LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 LM3424 Constant Current N-Channel Controller with Thermal Foldback for Driving LEDs Check for Samples: LM3424 FEATURES DESCRIPTION • The LM3424 is a versatile high voltage N-channel MosFET controller for LED drivers . It can be easily configured in buck, boost, buck-boost and SEPIC topologies. In addition, the LM3424 includes a thermal foldback feature for temperature management of the LEDs.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com Typical Boost Application Circuit VIN 1 2 3 4 5 PWM 6 7 8 TEMP 9 LM3424 VIN HSP HSN EN COMP SLOPE CSH IS RT/SYNC VCC GATE nDIM GND SS DDRV TGAIN TSENSE OVP 20 19 18 17 ILED 16 15 14 13 12 DAP 10 TREF VS 11 100 EFFICIENCY (%) 95 90 85 80 10 15 20 25 30 VIN (V) Figure 1.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 Connection Diagram VIN 1 20 HSP EN 2 19 HSN COMP 3 18 SLOPE CSH 4 RT 17 IS 21 5 16 VCC DAP nDIM 6 15 GATE SS 7 14 GND TGAIN 8 13 DDRV 12 OVP TSENSE 9 11 VS TREF 10 Figure 2. 20-Lead HTSSOP EP PIN DESCRIPTIONS Pin Name Description Application Information Bypass with 100 nF capacitor to GND as close to the device as possible. 1 VIN Input Voltage 2 EN Enable 3 COMP Compensation 4 5 CSH RT Connect to > 2.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com PIN DESCRIPTIONS (continued) Pin (1) 4 Name Description 15 GATE Main Gate Drive Output 16 VCC Internal Regulator Output Application Information Connect to gate of main switching MosFET. Bypass with a 2.2 µF – 3.3 µF, ceramic capacitor to GND. Connect to the drain of the main Nchannel MosFET switch for RDS-ON sensing or to a sense resistor installed in the source of the same device.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) VIN, EN, nDIM -0.3V to 76.0V -1 mA continuous OVP, HSP, HSN -0.3V to 76.0V -100 µA continuous IS -0.3V to 76.0V -2V for 100 ns -1 mA continuous VCC -0.3V to 8.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS (1) Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 ELECTRICAL CHARACTERISTICS(1) (continued) Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS(1) (continued) Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 TYPICAL PERFORMANCE CHARACTERISTICS TA=+25°C and VIN = 14V unless otherwise specified Boost Efficiency vs. Input Voltage VO = 32V (9 LEDs) (1) 100 Buck-Boost Efficiency vs. Input Voltage VO = 21V (6 LEDs) (2) 100 95 EFFICIENCY (%) EFFICIENCY (%) 95 90 90 85 80 85 75 80 10 15 20 25 70 30 0 16 32 80 Figure 4. Boost LED Current vs. Input Voltage VO = 32V (9 LEDs) (1) Buck-Boost LED Current vs.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) TA=+25°C and VIN = 14V unless otherwise specified VCSH vs. Junction Temperature 1.250 7.20 1.245 VCC vs. Junction Temperature 7.10 7.00 VCC (V) VCSH (V) 1.240 1.235 6.90 1.230 6.80 1.225 1.220 -50 -14 22 58 94 6.70 -50 130 -14 22 58 94 130 TEMPERATURE (°C) TEMPERATURE (°C) Figure 9. Figure 10. VS vs. Junction Temperature 248 2.500 VLIM vs.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 TYPICAL PERFORMANCE CHARACTERISTICS (continued) TA=+25°C and VIN = 14V unless otherwise specified ITF vs. Junction Temperature RGAIN = 10 kΩ; VTSENSE = 0.5V; VTREF = 1.5V fSW vs. RT 1M 100.3 100.1 RT (Ö) ITF (éA) 100k 99.9 10k 99.7 99.5 -50 -14 22 58 94 1k 10k 130 100k TEMPERATURE (°C) 1M 10M fSW (Hz) Figure 15. Figure 16. Ideal Thermal Foldback - Varied Slope RREF1 = RREF2 = 49.9 kΩ; RNTC-BK = RBIAS = 43.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com BLOCK DIAGRAM VIN 6.9V LDO Regulator EN VCC 820k UVLO (4.1V) VCC UVLO UVLO HYSTERESIS 1.24V Standby 20 PA nDIM REFERENCE TLIM Thermal VCC Limit Dimming 1.24V DDRV OVLO Reset Dominant Clock RT Oscillator S Artificial Ramp VCC Q GATE SLOPE R LEB GND W = 240 ns COMP 20 PA 1.24V PWM OVP HYSTERESIS CSH OVP OVLO HSP 90k 1.24V 10 PA HSN 1.7k 1.24V CURRENT LIMIT IS 0.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 THEORY OF OPERATION The LM3424 is an N-channel MosFET (NFET) controller for buck, boost and buck-boost current regulators which are ideal for driving LED loads. The controller has wide input voltage range allowing for regulation of a variety of LED loads. The high-side differential current sense, with low adjustable threshold voltage, provides an excellent method for regulating output current while maintaining high system efficiency.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com PEAK CURRENT MODE CONTROL Peak current mode control is used by the LM3424 to regulate the average LED current through an array of HBLEDs. This method of control uses a series resistor in the LED path to sense LED current and can use either a series resistor in the MosFET path or the MosFET RDS-ON for both cycle-by-cycle current limit and input voltage feed forward.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 ILED can then be calculated: ILED = VSNS 1.24V RHSP x = RSNS RSNS RCSH (7) The selection of the three resistors (RSNS, RCSH, and RHSP) is not arbitrary. For matching and noise performance, the suggested signal current ICSH is approximately 100 µA. This current does not flow in the LEDs and will not affect either the off-state LED current or the regulated LED current.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com ILED v 1 RGAIN 0 TBK TEND T Figure 23. Ideal Thermal Foldback Profile Foldback is accomplished by adding current (ITF) to the CSH summing node. As more current is added, less current is needed from the high side amplifier and correspondingly, the LED current is regulated to a lower value. The final temperature (TEND) is reached when ITF = ICSH causing no current to be needed from the high-side amplifier, yielding ILED = 0A.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 Since the NTC is not usually local to the controller, a bypass capacitor (CNTC) is suggested from TSENSE to GND. If a capacitor is used at TSENSE, then a capacitor (CREF) of equal or greater value should be placed from TREF to GND in order to ensure the controller does not start-up in foldback. Alternatively, a smaller CREF can be used to create a fade-up function at start-up (see APPLICATIONS INFORMATION section).
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com THERMAL SHUTDOWN The LM3424 includes thermal shutdown. If the die temperature reaches approximately 165°C the device will shut down (GATE pin low), until it reaches approximately 140°C where it turns on again. CURRENT SENSE/CURRENT LIMIT The LM3424 achieves peak current mode control using a comparator that monitors the main MosFET (Q1) transistor current, comparing it with the COMP pin voltage as shown in Figure 25.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 The LM3424 mitigates current mode instability by implementing an aritifical ramp (commonly called slope compensation) which is summed with the sensed MosFET current at the IS pin as shown in Figure 25. This combined signal is compared to the COMP pin to generate the PWM signal. An increase in the ramp that is added to the sense voltage will increase the maximum achievable duty cycle.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com And the right half plane zero (ωZ1) is: ZZ1 = rD x Dc2 D x L1 (18) 100 öZ1 80 135 öP1 90 GAIN GAIN (dB) 0 40 PHASE -45 20 0° Phase Margin -90 0 -20 -135 -40 -180 -60 1e-1 PHASE (°) 45 60 1e1 1e3 -225 1e7 1e5 FREQUENCY (Hz) Figure 27. Uncompensated Loop Gain Frequency Response Figure 27 shows the uncompensated loop gain in a worst-case scenario when the RHP zero is below the output pole.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 The dominant compensation pole (ωP2) is determined by CCMP and the output resistance (RO) of the error amplifier (typically 5 MΩ): ZP2 = 1 5e6: x CCMP (19) It may also be necessary to add one final pole at least one decade above the crossover frequency to attenuate switching noise and, in some cases, provide better gain margin. This pole can be placed across RSNS to filter the ESL of the sense resistor at the same time.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com START-UP REGULATOR and SOFT-START The LM3424 includes a high voltage, low dropout bias regulator. When power is applied, the regulator is enabled and sources current into an external capacitor (CBYP) connected to the VCC pin. The recommended bypass capacitance for the VCC regulator is 2.2 µF to 3.3 µF.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 The LM3424 can be configured to detect an output (or input) over-voltage condition via the OVP pin. The pin features a precision 1.24V threshold with 20 µA (typical) of hysteresis current as shown in Figure 31. When the OVLO threshold is exceeded, the GATE pin is immediately pulled low and a 20 µA current source provides hysteresis to the lower threshold of the OVLO hysteretic band.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com When using the nDIM pin for UVLO and PWM dimming concurrently, the UVLO circuit can have an extra series resistor to set the hysteresis. This allows the standard resistor divider to have smaller resistor values minimizing PWM delays due to a pull-down MosFET at the nDIM pin (see PWM DIMMING section). In general, at least 3V of hysteresis is preferable when PWM dimming, if operating near the UVLO threshold.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 When using the PWM functionality in a boost regulator, the PWM signal drives a ground referenced FET. However, with buck-boost and buck topologies, level shifting circuitry is necessary to translate the PWM dim signal to the floating dimFET as shown in Figure 35 and Figure 36. When using a series dimFET to PWM dim the LED current, more output capacitance is always better. A general rule of thumb is to use a minimum of 40 µF when PWM dimming.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com INDUCTOR The inductor (L1) is the main energy storage device in a switching regulator. Depending on the topology, energy is stored in the inductor and transferred to the load in different ways (as an example, buck-boost operation is detailed in the CURRENT REGULATORS section). The size of the inductor, the voltage across it, and the length of the switching subinterval (tON or tOFF) determines the inductor current ripple (ΔiL-PP ).
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 INPUT CAPACITORS The input capacitance (CIN) provides energy during the discontinuous portions of the switching period. For buck and buck-boost regulators, CIN provides energy during tON and during tOFF, the input voltage source charges up CIN with the average input current (IIN). For boost regulators, CIN only needs to provide the ripple current due to the direct connection to the inductor.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com Discontinuous currents are the most likely to generate EMI, therefore care should be taken when routing these paths. The main path for discontinuous current in the LM3424 buck regulator contains the input capacitor (CIN), the recirculating diode (D1), the N-channel MosFET (Q1), and the sense resistor (RLIM). In the LM3424 boost regulator, the discontinuous current flows through the output capacitor (CO), D1, Q1, and RLIM.
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LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 Design Guide Refer to Basic Topology Schematics section.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com 3. AVERAGE LED CURRENT For all topologies, set the average LED current (ILED) knowing the desired current sense voltage (VSNS) and solving for RSNS: RSNS = VSNS ILED (42) If the calculated RSNS is too far from a desired standard value, then VSNS will have to be adjusted to obtain a standard value. Setup the suggested signal current of 100 µA by assuming RCSH = 12.4 kΩ and solving for RHSP: RHSP = ILED x RCSH x RSNS 1.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 6. LED RIPPLE CURRENT Set the nominal LED ripple current (ΔiLED-PP), by solving for the output capacitance (CO): Buck CO = 'iL - PP 8 x fSW x rD x 'iLED - PP (50) Boost and Buck-boost CO = ILED x D rD xüiLED- PP x fSW (51) To set the worst case LED ripple current, use DMAX when solving for CO. Remember, when PWM dimming it is recommended to use a minimum of 40 µF of output capacitance to improve performance.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 The total system loop gain (T) can then be written as: Buck T = TU0 x § s · ¨1+ ¸ ¨ ZP1¸ x © ¹ 1 § s · § s · ¸ ¨1+ ¸ ¨ ¨ ZP2¸ x ¨1+ ZP3¸ ¹ © ¹ © (70) Boost and Buck-boost § s · ¸ ¨1 ¨ ZZ1¸ ¹ © T = TU0 x § s · § s · § s · ¸ ¨ ¸ ¨ ¸ ¨1+ ¨ ZP1¸ x ¨1+ ZP2¸ x ¨1+ ZP3¸ ¹ © ¹ © ¹ © (71) 10.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 A small filter capacitor (COVP = 47 pF) should be added from the OVP pin to ground to reduce coupled switching noise. 14. INPUT UVLO For all topologies, input UVLO is programmed with the turn-on threshold voltage (VTURN-ON) and the desired hysteresis (VHYS). Method #1: If no PWM dimming is required, a two resistor network can be used. To set VHYS, solve for RUV2: RUV2 = VHYS 20 PA (95) To set VTURN-ON, solve for RUV1: RUV1 = 1.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 SPECIFICATIONS N=6 VLED = 3.5V rLED = 325 mΩ VIN = 24V VIN-MIN = 10V VIN-MAX = 70V fSW = 500 kHz VSNS = 100 mV ILED = 1A ΔiL-PP = 700 mA ΔiLED-PP = 12 mA ΔvIN-PP = 100 mV ILIM = 6A VTURN-ON = 10V VHYS = 3V VTURN-OFF = 40V VHYSO = 10V TBK = 70°C TEND= 120°C tTSU = 30 ms 1. OPERATING POINT Solve for VO and rD: VO = N x VLED = 6 x 3.5V = 21V (101) rD = N x rLED = 6 x 325 m: = 1. 95: (102) Solve for D, D', DMAX, and DMIN: D= VO 21V = = 0.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com 2. SWITCHING FREQUENCY Solve for RT: RT = 1+1.95e- 8 x fSW 1+1.95e- 8 x 500 kHz = = 14.4 k: 1. 40e-10 x fSW 1.40e-10 x 500 kHz (107) The closest standard resistor is 14.3 kΩ therefore fSW is: 1 1.40e 10 x R T - 1.95e 8 1 fSW = - = 504 kHz 1.40e-10 x 14.3 k: - 1.95e 8 fSW = (108) The chosen component from step 2 is: RT = 14.3 k: (109) 3. AVERAGE LED CURRENT Solve for RSNS: VSNS 100 mV = = 0.1: ILED 1A RSNS = (110) Assume RCSH = 12.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 5. INDUCTOR RIPPLE CURRENT Solve for L1: L1 = VIN x D 24V x 0. 467 = = 32 PH 'iL- PP x fSW 700 mA x 504 kHz (116) The closest standard inductor is 33 µH therefore ΔiL-PP is: 'iL- PP = VIN x D 24V x 0. 467 = 674 mA = L1 x fSW 33 PH x 504 kHz (117) Determine minimum allowable RMS current rating: 2 IL - RMS = ILED 1 §¨ 'iL - PP x Dc·¸ x x 1+ 12 ¨© ILED ¸¹ Dc IL - RMS = 1 §674 mA x 0.533· 1.89A 1A x¨ x 1+ ¸¸ = 1A 12 ¨© 0.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com 8. SLOPE COMPENSATION Solve for RSLP: R SLP = 1.5 e13 x L1 VO x R T x RSNS R SLP = 1. 5 e13 x 33 PH = 16.5 k: 21V x 14.3 k: x 0.1: (127) The chosen component from step 8 is: R SLP = 16.5 k: (128) 9. LOOP COMPENSATION ωP1 is approximated: rad 1.467 1+ D = = 19 k sec rD x CO 1.95: x 40 PF ZP1 = (129) ωZ1 is approximated: rD x Dc2 1.95: x 0.5332 rad = = 36k D x L1 0.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 10. INPUT CAPACITANCE Solve for the minimum CIN: CIN = ILED x D 1A x 0. 467 = = 9.27 PF 'vIN- PP x fSW 100 mV x 504 kHz (137) To minimize power supply interaction a 200% larger capacitance of approximately 20 µF is used, therefore the actual ΔvIN-PP is much lower. Since high voltage ceramic capacitor selection is limited, four 4.7 µF X7R capacitors are chosen. Determine minimum allowable RMS current rating: IIN- RMS = ILED x DMAX 0.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com 13. INPUT UVLO Solve for RUV2: R UV2 = VHYS 3V = = 150 k: 20 P A 20 PA (149) The closest standard resistor is 150 kΩ therefore VHYS is: VHYS = RUV2 x 20 P A = 150 k: x 20 P A = 3V (150) Solve for RUV1: R UV1 = 1.24V x R UV2 1.24V x 150 k: = = 21.2 k: VTURN - ON - 1.24V 10V -1.24V (151) The closest standard resistor is 21 kΩ making VTURN-ON: 1.24V x (R UV1 + R UV2) VTURN - ON = VTURN- ON = R UV1 1.24V x (21 k: + 150 k:) = 10.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 15. SOFT-START Solve for tSU: t SU = 168: x CBYP + 36 k: x CCMP + VO x CO ILED t SU = 168: x 2.2 PF + 36 k: x 0. 33 PF + 21V x 40 PF 1A t SU = 13.1 ms (159) If tSU is less than tTSU, solve for tSU-SS-BASE: t SU - SS - BASE = 168: x CBYP + 28 k: x CCMP + VO x CO ILED t SU SS BASE = 168: x 2.2 PF + 28 k: x 0. 33 PF + t SU SS BASE = 10.5 ms (160) Solve for CSS: (t TSU - t SU - SS - BASE) (30 ms - 10.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #1 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 2 CCMP, CNTC 0.33 µF X7R 10% 25V MURATA GRM21BR71E334KA01L 1 CFS 0.27 µF X7R 10% 25V MURATA GRM21BR71E274KA01L 4 CIN 4.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 APPLICATIONS INFORMATION The following designs are provided as reference circuits. For a specific design, the steps in the Design Guide section should be performed. In all designs, an RC filter (0.1 µF, 10Ω) is recommended at VIN placed as close as possible to the LM3424 device. This filter is not shown in the following designs.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #2 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 1 CCMP 0.1 µF X7R 10% 25V MURATA GRM21BR71E104KA01L 0 CFS DNP 4 CIN 4.7 µF X7R 10% 100V TDK C5750X7R2A475K 4 COUT 10 µF X7R 10% 50V TDK C4532X7R1H106K 1 COV 47 pF COG/NPO 5% 50V AVX 08055A470JAT2A 2 CNTC, CSS 0.
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LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #3 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CB 100 pF COG/NPO 5% 50V MURATA GRM2165C1H101JA01D 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 3 CCMP, CREF, CSS 1 µF X7R 10% 25V MURATA GRM21BR71E105KA01L 1 CF 0.1 µF X7R 10% 25V MURATA GRM21BR71E104KA01L 0 CFS DNP 4 CIN 6.8 µF X7R 10% 50V TDK C5750X7R1H685K 1 CNTC 0.
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LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #4 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 3 CCMP, CREF, CSS 1 µF X7R 10% 25V MURATA GRM21BR71E105KA01L 1 CNTC 0.33 µF X7R 10% 25V MURATA GRM21BR71E334KA01L 1 CFS 0.1 µF X7R 10% 25V MURATA GRM21BR71E104KA01L 4 CIN 4.
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LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #5 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CB 100 pF COG/NPO 5% 50V MURATA GRM2165C1H101JA01D 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 2 CCMP, CSS 1 µF X7R 10% 25V MURATA GRM21BR71E105KA01L 1 CREF 0.01 µF X7R 10% 25V MURATA GRM21BR71E103KA01L 1 CF 0.1 µF X7R 10% 25V MURATA GRM21BR71E104KA01L 0 CFS DNP 4 CIN 4.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 DESIGN #6 - BUCK Application 15V ± 50V VIN L1 CIN RHSP 1 RUV2 2 VIN LM3424 HSP HSN EN 20 19 CFS RHSN RSNS RFS CCMP 3 COMP SLOPE 18 CO RSLP RPU RCSH RT 4 5 CSH IS RT/SYNC VCC D2 17 ROV2 Q2 1.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #6 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 2 CCMP, CDIM 0.1 µF X7R 10% 25V MURATA GRM21BR71E104KA01L 0 CFS DNP 1 CNTC 0.33 µF X7R 10% 25V MURATA GRM21BR71E334KA01L 4 CIN 4.
LM3424 www.ti.com SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 DESIGN #7 - BUCK-BOOST Application 15V ± 60V VIN D1 L1 CIN RHSP 1 RUV2 2 CCMP RCSH 3 4 VIN LM3424 HSP COUT HSN EN SLOPE COMP CSH 20 IS 19 18 RHSN 2.
LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #7 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 2 CAC, CFLT 100 pF COG/NPO 5% 50V MURATA GRM2165C1H101JA01D 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 3 CCMP, CNTC, CSS 0.33 µF X7R 10% 25V MURATA GRM21BR71E334KA01L 1 CFS 0.1 µF X7R 10% 25V MURATA GRM21BR71E104KA01L 4 CIN 4.
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LM3424 SNVS603B – AUGUST 2009 – REVISED OCTOBER 2009 www.ti.com DESIGN #8 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3424 Boost controller TI LM3424MH 1 CBYP 2.2 µF X7R 10% 16V MURATA GRM21BR71C225KA12L 3 CCMP, CNTC, CSS 0.47 µF X7R 10% 25V MURATA GRM21BR71E474KA01L 0 CFS DNP 4 CIN 4.7 µF X7R 10% 100V TDK C5750X7R2A475K 4 COUT 10 µF X7R 10% 50V TDK C4532X7R1H106K 1 CSEP 1.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM3424MHX/NOPB HTSSOP PWP 20 2500 330.0 16.4 LM3424QMHX/NOPB HTSSOP PWP 20 2500 330.0 16.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.95 7.1 1.6 8.0 16.0 Q1 6.95 7.1 1.6 8.0 16.
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3424MHX/NOPB HTSSOP PWP 20 2500 367.0 367.0 35.0 LM3424QMHX/NOPB HTSSOP PWP 20 2500 367.0 367.0 35.
MECHANICAL DATA PWP0020A MXA20A (Rev C) www.ti.
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