LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 525kHz/1.6MHz, Constant Current Boost and SEPIC LED Driver with Internal Compensation Check for Samples: LM3410, LM3410Q FEATURES DESCRIPTION • • • • • The LM3410 constant current LED driver is a monolithic, high frequency, PWM DC/DC converter in 5-pin 1 23 • • • • • • Space Saving SOT-23 and WSON Packages Input Voltage Range of 2.7V to 5.5V Output Voltage Range of 3V to 24V 2.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Connection Diagram SW 1 5 VIN PGND 1 6 SW VIN 2 5 AGND GND 2 FB 3 4 NC 1 8 NC PGND 2 7 SW VIN 3 6 AGND DIM 4 5 FB DIM DIM Figure 1. 5-Pin SOT-23 (Top View) See DBV Package 3 4 FB Figure 2. 6-Pin WSON (Top View) See NGG0006A Package Figure 3. 8-Pin MSOP-PowerPad (Top View) See GDN0008A Package Table 1. Pin Descriptions - 5-Pin SOT-23 Pin Name Function 1 SW 2 GND Output switch.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 Table 3. Pin Descriptions - 8-Pin MSOP-PowerPad Pin Name 1 - Function 2 PGND 3 VIN Supply voltage for power stage, and input supply voltage. 4 DIM Dimming and shutdown control input. Logic high enables operation. Duty Cycle from 0 to 100%. Do not allow this pin to float or be greater than VIN + 0.3V. 5 FB Feedback pin. Connect FB to external resistor divider to set output voltage.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to 125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. VIN = 5V, unless otherwise indicated under the Conditions column.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 Typical Performance Characteristics All curves taken at VIN = 5.0V with configuration in typical application circuit shown in Application Information section of this datasheet. TJ = 25C, unless otherwise specified. LM3410X Efficiency vs VIN (RSET = 4Ω) LM3410X Start-Up Signature Figure 4. Figure 5. 4 x 3.3V LEDs 500 Hz DIM FREQ D = 50% DIM Freq and Duty Cycle vs Avg I-LED Figure 6. Figure 7.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) All curves taken at VIN = 5.0V with configuration in typical application circuit shown in Application Information section of this datasheet. TJ = 25C, unless otherwise specified. Oscillator Frequency vs Temperature - "X" Oscillator Frequency vs Temperature - "Y" Figure 10. Figure 11. VFB vs Temperature Figure 12.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 Simplified Internal Block Diagram DIM VIN ThermalSHDN Control Logic + RampArtificial UVLO = 2.3V Oscillator + - cv 1.6 MHz + S R SW + NMOS + R Q - VFB + VREF = 190 mV Internal Compensation ILIMIT ISENSE + GND Figure 13.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION THEORY OF OPERATION The LM3410 is a constant frequency PWM, boost regulator IC. It delivers a minimum of 2.1A peak switch current. The device operates very similar to a voltage regulated boost converter except that it regulates the output current through LEDs. The current magnitude is set with a series resistor.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 VOUT + VD Vsw (t) t VIN VL(t) t VIN - VOUT - VD I L (t) iL t I DIODE (t) t ( iL - - i OUT ) I Capacitor (t) t - i OUT 'v VOUT (t) DTS TS Figure 15. Typical Waveforms CURRENT LIMIT The LM3410 uses cycle-by-cycle current limiting to protect the internal NMOS switch. It is important to note that this current limit will not protect the output from excessive current during an output short circuit.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Design Guide SETTING THE LED CURRENT ILED VFB RSET Figure 16. Setting ILED The LED current is set using the following equation: VFB = ILED RSET where • RSET is connected between the FB pin and GND. (1) DIM PIN / SHUTDOWN MODE The average LED current can be controlled using a PWM signal on the DIM pin. The duty cycle can be varied between 0 and 100% to either increase or decrease LED brightness.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 'i L I L (t) iL VIN L VIN - VOUT L DTS TS t Figure 17. Inductor Current 2'iL § VIN · = ¸ DTS ¨© L ¹ § VIN · ¸ x DTS 'iL = ¨ © 2L ¹ (3) The Duty Cycle (D) for a Boost converter can be approximated by using the ratio of output voltage (VOUT) to input voltage (VIN).
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com From the previous equations, the inductor value is then obtained. § VIN · L= ¨ ¸ x DTS ©2'iL¹ (9) Where 1/TS = fSW (10) One must also ensure that the minimum current limit (2.1A) is not exceeded, so the peak current in the inductor must be calculated.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 DIODE The diode (D1) conducts during the switch off time. A Schottky diode is recommended for its fast switching times and low forward voltage drop. The diode should be chosen so that its current rating is greater than: ID1 ≥ IOUT (13) The reverse breakdown rating of the diode must be at least the maximum output voltage plus appropriate margin.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Below is an example of a good thermal and electrical PCB design. LEDs PCB R1 PGND DIM FB 4 3 AGND 5 C2 2 VIN VSW VO 6 1 PGND D1 C1 SW L1 Figure 19. Boost PCB Layout Guidelines This is very similar to our LM3410 demonstration boards that are obtainable via the Texas Instruments website. The demonstration board consists of a two layer PCB with a common input and output voltage application.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 External Components: Choose components that are efficient, and you can reduce the mutual heating between devices. PCB design with thermal performance in mind: The PCB design is a very important step in the thermal design procedure. The LM3410 is available in three package options (5-pin SOT-23, 8-pin MSOP-PowerPad and 6-pin WSON). The options are electrically the same, but difference between the packages is size and thermal performance.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Thermal Definitions Heat energy is transferred from regions of high temperature to regions of low temperature via three basic mechanisms: radiation, conduction and convection. Radiation: Electromagnetic transfer of heat between masses at different temperatures. Conduction: Transfer of heat through a solid medium. Convection: Transfer of heat through the medium of a fluid; typically air.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 RTCASE-AMB TCASE CTCASE-AMB RTJ-CASE CTJ-CASE INTERNAL PDISS SMALL LARGE PDISS-TOP TAMBIENT PDISS-PCB TJUNCTION RTJ-PCB CTJ-PCB DEVICE EXTERNAL PDISS RTPCB-AMB TPCB CTPCB-AMB PCB Figure 22.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com Calculating Efficiency and Junction Temperature We will talk more about calculating proper junction temperature with relative certainty in a moment. For now we need to describe how to calculate the junction temperature and clarify some common misconceptions. TJ - TA RTJA = PDissipation (14) A common error when calculating RθJA is to assume that the package is the only variable to consider.
LM3410, LM3410Q www.ti.com VOUT VIN SNVS541G – OCTOBER 2007 – REVISED MAY 2013 1 = '¶ (19) And we know: VOUT VIN = K '¶ (20) Therefore: K = Dc VOUT VIN § Dc x VD · 1¨ ¸ V ¨ ¸ IN =¨ + (D x R DSON) ¸ R ¨ 1 + DCR ¸ ¨ ¸ 2 c R D ¹ © OUT (21) Calculations for determining the most significant power losses are discussed below. Other losses totaling less than 2% are not discussed.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com 'i IIN ISW(t) t Figure 23. LM3410 Switch Current Isw-rms = IIND D x 1 + 1 3 'i IIND 2 | IIND D (27) (small ripple approximation) PCOND-NFET = IIN2 x RDSON x D (28) Or 2 §I · PCOND - NFET = ¨ LED¸ x RDSON x D © D' ¹ (29) The value for RDSON should be equal to the resistance at the junction temperature you wish to analyze. As an example, at 125°C and RDSON = 250 mΩ (See typical graphs for value).
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 Table 5. Operating Conditions VIN 3.3V VOUT 16.7V ILED 50mA VD 0.45V fSW 1.60MHz IQ 3mA tRISE 10nS tFALL 10nS RDSON 225mΩ LDCR 75mΩ D 0.82 IIN 0.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com PINTERNAL = PCOND + PSW = 107 mW (48) Calculating RθJA and RΨJC TJ - TCase TJ - TA : R
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 Figure 24. RθJA vs Internal Dissipation For 5-pin SOT-23 package typical applications, RθJA numbers will range from 80°C/W to 110°C/W, and RΨJC will vary between 50°C/W and 65°C/W. These values are for PCB’s with two and four layer boards with 0.5 oz copper, with two to four thermal vias from GND pin to bottom layer.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 I L2 www.ti.com § D' · = ¨ ¸ x I L1 © D¹ and IL1 = §D· x ¨ D' ¸ © ¹ ILED (58) Substituting IL1 into IL2 IL2 = ILED (59) The average inductor current of L2 is the average output load. VL(t) AREA 1 t (s) AREA 2 DTS TS Figure 25.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 VIN L1 LM3410 C1 1 6 2 5 3 4 VO D1 C3 C2 L2 HB/OLED R2 R1 Figure 26. HB/OLED SEPIC CONVERTER Schematic Steady State Analysis with Loss Elements i L1( t ) i sw iC1( t ) vC1( t ) + i D1( t ) vD1( t ) i L 2( t ) VIN i C2( t ) vL2( t ) + - + R L1 vL1( t ) + vC2( t ) vO( t ) - + R on R L2 Figure 27.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 ROUT = www.ti.com VOUT ILED (66) Therefore: § · ¨ ¸ 1 ¨ ¸ K= ¨§ ¸ 2· § § · · V R R R D D § · · § ¸ ¨ L1 ¸ ¸ ¸ ¨ ON ¸ + ¨ ¨ ¨1+ D + L2 ¸ + ¨ ¨ ¨© VOUT ROUT¸¹ ¨ D' 2 ¸ ©ROUT ¹ ¨ D' 2 ¸ ©ROUT¹ ¸ © © ¹ ¹ ¨ ¸ © ¹ (67) One can see that all variables are known except for the duty cycle (D). A quadratic equation is needed to solve for D. A less accurate method of determining the duty cycle is to assume efficiency, and calculate the duty cycle.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 LM3410X SOT-23 Design Example 1: 5 x 1206 Series LED String Application D1 L1 LEDs VIN LM3410 DIMM C1 4 3 2 R2 5 C2 1 R1 Figure 29. LM3410X (1.6MHz): VIN = 2.7V to 5.5V, 5 x 3.3V LEDs, (VOUT ≊ 16.5V) ILED ≊ 50mA Part ID Part Value Manufacturer Part Number U1 2.8A ISW LED Driver TI LM3410XMF C1, Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 Output Cap 2.2µF, 25V, X5R TDK C2012X5R1E225M D1, Catch Diode 0.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com LM3410Y SOT-23 Design Example 2: 5 x 1206 Series LED String Application D1 L1 LEDs VIN LM3410 DIMM C1 4 3 2 R2 5 C2 1 R1 Figure 30. LM3410Y (525kHz): VIN = 2.7V to 5.5V, 5 x 3.3V LEDs, (VOUT ≊ 16.5V) ILED ≊ 50mA 28 Part ID Part Value Manufacturer Part Number U1 2.8A ISW LED Driver TI LM3410YMF C1, Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 Output Cap 2.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 LM3410X WSON Design Example 3: 7 LEDs x 5 LED String Backlighting Application L1 L EDs D1 VIN LM3410 C1 R2 1 6 2 5 3 4 I LED DIMM C2 I SET R1 Figure 31. LM3410X (1.6MHz): VIN = 2.7V to 5.5V, 7 x 5 x 3.3V LEDs, (VOUT ≊ 16.7V), ILED ≊ 25mA Part ID Part Value Manufacturer Part Number U1 2.8A ISW LED Driver TI LM3410XSD C1, Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 Output Cap 4.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com LM3410X WSON Design Example 4: 3 x HB LED String Application L1 D1 VIN LM3410 C1 R2 DIMM 1 6 2 5 3 4 HB - LEDs C2 R3 R1 Figure 32. LM3410X (1.6MHz): VIN = 2.7V to 5.5V, 3 x 3.4V LEDs, (VOUT ≊ 11V) ILED ≊ 340mA 30 Part ID Part Value Manufacturer U1 2.8A ISW LED Driver TI LM3410XSD C1, Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 Output Cap 2.2µF, 25V, X5R TDK C2012X5R1E225M D1, Catch Diode 0.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 LM3410Y SOT-23 Design Example 5: 5 x 1206 Series LED String Application with OVP L1 L EDs D1 VIN DIMM LM3410 C1 OVP 4 R2 3 C2 2 5 D2 1 R3 R1 Figure 33. LM3410Y (525kHz): VIN = 2.7V to 5.5V, 5 x 3.3V LEDs, (VOUT ≊ 16.5V) ILED ≊ 50mA Part ID Part Value Manufacturer U1 2.8A ISW LED Driver TI Part Number LM3410YMF C1 Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 Output Cap 2.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com LM3410X SEPIC WSON Design Example 6: HB/OLED Illumination Application VIN L1 VO D1 C3 LM3410 C1 1 6 2 5 3 4 C2 L2 HB/OLED R2 R1 Figure 34. LM3410X (1.6MHz): VIN = 2.7V to 5.5V, (VOUT ≊ 3.8V) ILED ≊ 300mA 32 Part ID Part Value Manufacturer U1 2.8A ISW LED Driver TI Part Number LM3410XSD C1 Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106K C2 Output Cap 10µF, 6.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 LM3410X WSON Design Example 7: Boost Flash Application VIN L1 D1 VO LM3410 C1 1 6 2 5 3 4 C2 LEDs FLASH CTRL R1 Figure 35. LM3410X (1.6MHz): VIN = 2.7V to 5.5V, (VOUT ≊ 8V) ILED ≊ 1.0A Pulsed Part ID Part Value Manufacturer U1 2.8A ISW LED Driver TI Part Number LM3410XSD C1 Input Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2012X5R1A106M C2 Output Cap 10µF,16V, X5R TDK D1, Catch Diode 0.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com LM3410X SOT-23 Design Example 8: 5 x 1206 Series LED String Application with VIN > 5.5V D1 L1 LEDs VPWR DIMM C1 R3 LM3410 4 2 R2 5 D2 3 C2 1 C3 R1 Figure 36. LM3410X (1.6MHz): VPWR = 9V to 14V, (VOUT ≊ 16.5V) ILED ≊ 50mA 34 Part ID Part Value Mfg U1 2.8A ISW LED Driver TI Part Number LM3410XMF C1 Input VPWR Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 Output Cap 2.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 LM3410X WSON Design Example 9: Camera Flash or Strobe Circuit Application VIN L1 C1 C3 VO D1 LM3410 1 6 2 5 3 4 L2 LED(s) R2 C2 Q2 R3 R1 R4 Q1 FLASH CTRL Figure 37. LM3410X (1.6MHz): VIN = 2.7V to 5.5, (VOUT ≊ 7.5V), ILED ≊ 1.5A Flash Part ID Part Value Mfg U1 2.8A ISW LED Driver TI Part Number LM3410XSD C1 Input VPWR Cap 10µF, 6.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com LM3410X SOT-23 Design Example 10: 5 x 1206 Series LED String Application with VIN and VPWR Rail > 5.5V L1 D1 LEDs VPWR LM3410 DIMM C1 4 2 R2 VIN 3 5 C2 1 C3 R1 Figure 38. LM3410X (1.6MHz): VPWR = 9V to 14V, VIN = 2.7V to 5.5V, (VOUT ≊ 16.5V) ILED ≊ 50mA 36 Part ID Part Value Mfg Part Number U1 2.8A ISW LED Driver TI LM3410XMF C1 Input VPWR Cap 10µF, 6.3V, X5R TDK C2012X5R0J106M C2 VOUT Cap 2.
LM3410, LM3410Q www.ti.com SNVS541G – OCTOBER 2007 – REVISED MAY 2013 LM3410X WSON Design Example 11: Boot-Strap Circuit to Extend Battery Life VIN L1 VO D1 C4 D2 C1 LM3410 C3 1 6 2 5 3 4 L2 C2 R3 D3 R1 Figure 39. LM3410X (1.6MHz): VIN = 1.9V to 5.5V, VIN > 2.3V (TYP) for Startup, ILED ≊ 300mA Part ID Part Value Mfg Part Number U1 2.8A ISW LED Driver TI LM3410XSD C1 Input VPWR Cap 10µF, 6.3V, X5R TDK C1608X5R0J106K C2 VOUT Cap 10µF, 6.
LM3410, LM3410Q SNVS541G – OCTOBER 2007 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision F (May 2013) to Revision G • 38 Page Changed layout of National Data Sheet to TI format ..........................................................................................................
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com 2-May-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM3410XMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 LM3410XMFE/NOPB SOT-23 DBV 5 250 178.0 LM3410XMFX/NOPB SOT-23 DBV 5 3000 178.
PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM3410YMY/NOPB MSOPPower PAD DGN 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3410YMYE/NOPB MSOPPower PAD DGN 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3410YMYX/NOPB MSOPPower PAD DGN 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3410YQMF/NOPB SOT-23 DBV 5 1000 178.0 8.
PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3410XMYX/NOPB MSOP-PowerPAD DGN 8 3500 367.0 367.0 35.0 LM3410XQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM3410XQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM3410XSD/NOPB WSON NGG 6 1000 210.0 185.0 35.0 LM3410XSDE/NOPB WSON NGG 6 250 210.0 185.0 35.0 LM3410XSDX/NOPB WSON NGG 6 4500 367.0 367.0 35.
MECHANICAL DATA DGN0008A MUY08A (Rev A) BOTTOM VIEW www.ti.
MECHANICAL DATA NGG0006A SDE06A (Rev A) www.ti.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.