Datasheet

LM340-N, LM78xx
www.ti.com SNOSBT0I –FEBRUARY 2000–REVISED MARCH 2013
Figure 25. Maximum Power Dissipation vs T
AMB
for the DDPAK/TO-263 Package
Figure 26 and Figure 27 show the information for the SOT-223 package. Figure 26 assumes a θ
(J–A)
of 74°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.
Figure 26. θ
(J–A)
vs Copper (2 ounce) Area
for the SOT-223 Package
Figure 27. Maximum Power Dissipation vs
T
AMB
for the SOT-223 Package
Please see AN-1028 (SNVA036) for power enhancement techniques to be used with the SOT-223 package.
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