Datasheet

LM337L
www.ti.com
SNVS780D MAY 1998REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Power Dissipation Internally Limited
Input–Output Voltage Differential 40V
Operating Junction Temperature Range 25°C to +125°C
Storage Temperature 55°C to +150°C
Lead Temperature (Soldering, 10 sec.) 300°C
Plastic Package (Soldering 4 sec.) 260°C
ESD Rating 1.5kV
(3)
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 1.5k in series with 100pF.
Electrical Characteristics
(1)
Parameter Conditions Min Typ Max Units
Line Regulation T
A
= 25°C, 3V |V
IN
V
OUT
| 40V
(2)
0.01 0.04 %/V
Load Regulation T
A
= 25°C, 5mA I
OUT
I
MAX
(2)
0.1 0.5 %
Thermal Regulation T
A
= 25°C, 10ms Pulse 0.04 0.2 %/W
Adjustment Pin Current 50 100 μA
Adjustment Pin Current Change 5mA I
L
100mA
0.2 5 μA
3V |V
IN
V
OUT
| 40V
Reference Voltage 3V |V
IN
V
OUT
| 40V
(3)
1.20 1.25 1.30 V
10mA I
OUT
100mA, P 625mW
Line Regulation 3V |V
IN
V
OUT
| 40V
(2)
0.02 0.07 %/V
Load Regulation 5mA I
OUT
100mA
(2)
0.3 1.5 %
Temperature Stability T
MIN
T
j
T
MAX
0.65 %
Minimum Load Current |V
IN
V
OUT
| 40V 3.5 5 mA
3V |V
IN
V
OUT
| 15V 2.2 3.5 mA
Current Limit 3V |V
IN
V
OUT
| 13V 100 200 320 mA
|V
IN
V
OUT
| = 40V 25 50 120 mA
Rms Output Noise, % of V
OUT
T
A
= 25°C, 10Hz f 10kHz 0.003 %
Ripple Rejection Ratio V
OUT
= 10V, F = 120 Hz, C
ADJ
= 0 65 dB
C
ADJ
= 10μF 66 80 dB
Long-Term Stability T
A
= 125°C 0.3 1 %
(1) Unless otherwise specified, these specifications apply 25°C T
J
+ 125°C for the LM337L; |V
IN
V
OUT
| = 5V and I
OUT
= 40mA.
Although power dissipation is internally limited, these specifications are applicable for power dissipations up to 625 mW. I
MAX
is 100mA.
(2) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation.
(3) Thermal resistance of the TO-92 package is 180°C/W junction to ambient with 0.4 leads from a PC board and 160°C/W junction to
ambient with 0.125 lead length to PC board. The SOIC package θ
JA
is 180°C/W in still air. The 6-Bump DSBGA package θ
JA
is
290°C/W in still air.
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