Datasheet

LM3370
www.ti.com
SNVS406N NOVEMBER 2005REVISED MAY 2013
entry angle to prevent debris from being caught in deep corners. Initially, the trace to each pad should be 7 mil
wide, for a section approximately 7 mil long or longer, as a thermal relief. Then each trace should neck up or
down to its optimal width. The important criteria is symmetry. This ensures the solder bumps on the LM3370
DSBGA package re-flow evenly and that the device solders level to the board. In particular, special attention
must be paid to the pads for bumps A2/B1 of V
OUT1
, and E2/D1 of V
OUT2
, because V
IN
and PGND are typically
connected to large copper planes, inadequate thermal relief can result in late or inadequate re-flow of these
bumps.
The DSBGA package is optimized for the smallest possible size in applications with red or infrared opaque
cases. Because the DSBGA package lacks the plastic encapsulation characteristic of larger devices, it is
vulnerable to light. Backside metallization and/or epoxy coating, along with front-side shading by the printed
circuit board, reduce this sensitivity. However, the package has exposed die edges. In particular, DSBGA
devices are sensitive to light, in the red and infrared range, shining on the package’s exposed die edges.
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