Datasheet

Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Reverse Current 15 mA
Forward Current 10 mA
Storage Temperature −60˚C to +150˚C
Operating Temperature Range (Note 2)
LM136 −55˚C to +150˚C
LM236 −25˚C to +85˚C
LM336 0˚C to +70˚C
Soldering Information
TO-92 Package (10 sec.) 260˚C
TO-46 Package (10 sec.) 300˚C
SO Package
Vapor Phase (60 sec.) 215˚C
Infrared (15 sec.) 220˚C
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” (Appendix D) for other methods of
soldering surface mount devices.
Electrical Characteristics (Note 3)
LM136A-2.5/LM236A-2.5 LM336B-2.5
Parameter Conditions LM136-2.5/LM236-2.5 LM336-2.5 Units
Min Typ Max Min Typ Max
Reverse Breakdown
Voltage
T
A
=25˚C, I
R
=1 mA
LM136, LM236, LM336 2.440 2.490 2.540 2.390 2.490 2.590 V
LM136A, LM236A, LM336B 2.465 2.490 2.515 2.440 2.490 2.540 V
Reverse Breakdown
Change
T
A
=25˚C, 2.6 6 2.6 10 mV
With Current 400 µAI
R
10 mA
Reverse Dynamic
Impedance
T
A
=25˚C, I
R
=1 mA, f = 100 Hz 0.2 0.6 0.2 1
Temperature Stability V
R
Adjusted to 2.490V
(Note 4) I
R
=1 mA, Figure 2
0˚CT
A
70˚C (LM336) 1.8 6 mV
−25˚CT
A
+85˚C 3.5 9 mV
(LM236H, LM236Z)
−25˚C T
A
+85˚C (LM236M) 7.5 18 mV
−55˚CT
A
+125˚C (LM136) 12 18 mV
Reverse Breakdown
Change
400 µAI
R
10 mA 3 10 3 12 mV
With Current
Reverse Dynamic
Impedance
I
R
=1 mA 0.4 1 0.4 1.4
Long Term Stability T
A
=25˚C
±
0.1˚C, I
R
=1 mA, 20 20 ppm
t = 1000 hrs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its specified operating conditions.
Note 2: For elevated temperature operation, T
j
max is:
LM136 150˚C
LM236 125˚C
LM336 100˚C
Thermal Resistance TO-92 TO-46 SO-8
θ
ja
(Junction to Ambient) 180˚C/W (0.4" leads) 440˚C/W 165˚C/W
170˚C/W (0.125" lead)
θ
ja
(Junction to Case) n/a 80˚C/W n/a
LM136-2.5/LM236-2.5/LM336-2.5V
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