Datasheet

LM136-2.5-N
www.ti.com SNVS749F –MAY 1998–REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Reverse Current 15 mA
Forward Current 10 mA
Storage Temperature −60°C to +150°C
Operating Temperature Range
(3)
LM136 −55°C to +150°C
LM236 −25°C to +85°C
LM336 0°C to +70°C
Soldering Information TO-92 Package (10 sec.) 260°C
TO Package (10 sec.) 300°C
SOIC Package Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device beyond its specified operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) For elevated temperature operation, T
j
max is:
LM136 150°C
LM236 125°C
LM336 100°C
Thermal Resistance TO-92 TO SOIC
θ
ja
(Junction to Ambient) 180°C/W (0.4″ leads) 440°C/W 165°C/W
170°C/W (0.125″ lead)
θ
ja
(Junction to Case) n/a 80°C/W n/a
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