Datasheet
LM134, LM234, LM334
SNVS746C –MAY 2004–REVISED MARCH 2005
www.ti.com
Figure 3. TO-46 Metal Can Package Figure 4. TO-92 Plastic Package
(Bottom View) (Bottom View)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
V
+
to V
−
Forward Voltage
LM134/LM234/LM334 40V
LM234-3/LM234-6 30V
V
+
to V
−
Reverse Voltage 20V
R Pin to V
−
Voltage 5V
Set Current 10 mA
Power Dissipation 400 mW
ESD Susceptibility
(2)
2000V
Operating Temperature Range
(3)
LM134 −55°C to +125°C
LM234/LM234-3/LM234-6 −25°C to +100°C
LM334 0°C to +70°C
Soldering Information
TO-92 Package (10 sec.) 260°C
TO-46 Package (10 sec.) 300°C
SO Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
(1) .“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits.
(2) Human body model, 100pF discharged through a 1.5kΩ resistor.
(3) For elevated temperature operation, T
J
max see Thermal Characteristics
Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
LM134 150°C
LM234 125°C
LM334 100°C
Thermal Resistance TO-92 TO-46 SO-8
θ
ja
(Junction to Ambient) 180°C/W (0.4″ leads) 440°C/W 165°C/W
160°C/W (0.125″ leads)
θ
jc
(Junction to Case) N/A 32°C/W 80°C/W
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” (Appendix D) for other methods
of soldering surface mount devices.
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