Datasheet

LM134, LM234, LM334
SNVS746E –MARCH 2000–REVISED MAY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
V
+
to V
−
Forward Voltage LM134/LM234/LM334 40V
LM234-3/LM234-6 30V
V
+
to V
−
Reverse Voltage 20V
R Pin to V
−
Voltage 5V
Set Current 10 mA
Power Dissipation 400 mW
ESD Susceptibility
(3)
2000V
Operating Temperature Range
(4)
LM134 −55°C to +125°C
LM234/LM234-3/LM234-6 −25°C to +100°C
LM334 0°C to +70°C
Soldering Information TO-92 Package (10 sec.) 260°C
TO Package (10 sec.) 300°C
SOIC Package Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 100pF discharged through a 1.5kΩ resistor.
(4) For elevated temperature operation, T
J
max is:
LM134 150°C
LM234 125°C
LM334 100°C
See Thermal Characteristics.
Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
Thermal Resistance TO-92 TO SOIC-8
θ
ja
(Junction to Ambient) 180°C/W (0.4″ leads) 440°C/W 165°C/W
160°C/W (0.125″ leads)
θ
jc
(Junction to Case) N/A 32°C/W 80°C/W
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