Datasheet

LM329
SNVS748F –MAY 2000–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Reverse Breakdown Current 30 mA
Forward Current 2 mA
Operating Temperature Range LM329 0°C to +70°C
Storage Temperature Range −55°C to +150°C
Soldering Information TO-92 package: 10 sec. 260°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits.
Electrical Characteristics
(1)
Parameter Conditions Min Typ Max Units
Reverse Breakdown Voltage T
A
= 25°C, 0.6 mA ≤ I
R
≤ 15 mA 6.6 6.9 7.25 V
Reverse Breakdown Change T
A
= 25°C, with 0.6 mA ≤ I
R
≤ 15 mA 9 20 mV
Current
(2)
Reverse Dynamic Impedance
(2)
T
A
= 25°C, I
R
= 1 mA 0.8 2 Ω
RMS Noise T
A
= 25°C, 10 Hz ≤ F ≤ 10 kHz 7 100 μV
Long Term Stability (1000 hours) T
A
= 45°C ± 0.1°C, 20 ppm
I
R
= 1 mA ± 0.3%
Temperature Coefficient I
R
= 1 mA 50 100 ppm/°C
Change In Reverse Breakdown Temperature 1 mA ≤ I
R
≤ 15 mA 1 ppm/°C
Coefficient
Reverse Breakdown Change with Current 1 mA ≤ I
R
≤ 15 mA 12 mV
Reverse Dynamic Impedance 1 mA ≤ I
R
≤ 15 mA 1 Ω
(1) These specifications apply for 0°C ≤ T
A
≤ +70°C for the LM329 unless otherwise specified. The maximum junction temperature for a
LM329 is 100°C. For operating at elevated temperature. The TO-92 package, the derating is based on 180°C/W junction to ambient with
0.4″ leads from a PC board and 160°C/W junction to ambient with 0.125″ lead length to a PC board.
(2) These changes are tested on a pulsed basis with a low duty-cycle. For changes versus temperature, compute in terms of tempco.
Typical Applications
Figure 3. Low Cost 0–25V Regulator
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