Datasheet

BOM For Typical Configurations*

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5 BOM For Typical Configurations*

Designator Model Description Manufacturer

C1 CL05A106MQ5NUNC 10 µF, 6.3V, 0402 Samsung

C2 CL05A475MQ5NRNC 4.7 µF, 6.3V, 0402 Samsung

L1 LQM21PNR50XGHL11 0.5 µH, 2.0 x 1.25 x 1.0 mm Murata

C4 GRM32ER60J107ME 100 µF, 6.3V, 1210 Murata

U1 LM3262 Buck DC/DC Converter Texas Instruments

* Please refer to the LM3262 6MHz 800mA Mini, Adj., Step-Down DC-DC Cnvtr w Auto BP for RF PAs

(SNVS875) data sheet for a list of additional recommended external components.

NOTE: Note: If battery voltage source is note on the same PC board as the LM3262, user should

employ a 100 μF ceramic cap between VIN and GND terminals of the board to reduce

effects of wire impedance.

If considering using the LM3262 in a system design, please see the PCB Layout

Considerations section of the LM3262 6MHz 800mA Mini, Adj., Step-Down DC-DC Cnvtr w

Auto BP for RF PAs (SNVS875) data sheet.

Figure 2. LM3262 Evaluation Board

LM3262 DSBGA Evaluation Board SNVU159B–July 2012–Revised April 2013

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