Datasheet

LM3243
www.ti.com SNVS782B –OCTOBER 2010–REVISED FEBRUARY 2013
ABSOLUTE MAXIMUM RATINGS
(1)(2) (3)
VDD, PVIN to SGND −0.2V to +6.0V
PGND to SGND −0.2V to +0.2V
EN, FB, VCON, BP, MODE (SGND −0.2V)
to (VDD +0.2V)
SW, ACB (PGND −0.2V)
to (PVIN +0.2V
PVIN to VDD −0.2V to +0.2V
Continuous Power Dissipation
(4)
Internally Limited
Junction Temperature (T
J-MAX
) +150°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature (Soldering, 10 sec) +260°C
ESD Rating
(5)
,
(6)
2kV
Human Body Model:
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply verified performance limits. For performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) All voltages are with respect to the potential at the GND pins. The LM3243 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage
exceeds 2.7V.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 130°C (typ.).
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7)
(6) Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD
handling procedures can result in damage.
OPERATING RATINGS
(1) (2)
Input Voltage Range 2.7V to 5.5V
Recommended Load Current 0A to 2.5A
Junction Temperature (T
J
) Range −30°C to +125°C
Ambient Temperature (T
A
) Range
(3)
−30°C to +90°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins. The LM3243 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage
exceeds 2.7V.
(3) In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
). At higher power levels duty
cycle usage is assumed to drop (i.e., max power 12.5% usage is assumed) for 2G mode.
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (θ
JA
), YFQ16 Package
(1)
50°C/W
(1) Junction-to-ambient thermal resistance (θ
JA
) is taken from thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
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