Datasheet

LM3242
www.ti.com SNOSB48D –OCTOBER 2011–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)(3)
VIN to SGND −0.2V to +6.0V
PGND to SGND −0.2V to +0.2V
EN, VCON, BPEN (SGND−0.2V) to (VIN+0.2V) w/ 6.0V
SW, FB (PGND–0.2V) to (VIN+0.2V)
Continuous Power Dissipation Internally Limited
(4)
Junction Temperature (T
J-MAX
) +150°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature
(Soldering, 10 sec) +260°C
ESD Rating
(5)
Human Body Model: 2kV
Machine Model: 200V
Charged Device Model: 1250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) All voltages are with respect to the potential at the GND pins.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 125°C (typ.).
(5) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7) The machine
model is a 200 pF capacitor discharged directly into each pin.
Operating Ratings
(1)
Input Voltage Range 2.7V to 5.5V
Recommended Load Current 0mA to 750 mA
PWM Mode 0mA to 750 mA
Bypass Mode 0mA to 1000 mA
Junction Temperature (T
J
) Range −30°C to +125°C
Ambient Temperature (T
A
) Range −30°C to +90°C
(2)
(1) All voltages are with respect to the potential at the GND pins.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
Thermal Properties
Junction-to-Ambient Thermal 85°C/W
Resistance (θ
JA
), YFQ0009 Package
(1)
(1) Junction-to-ambient thermal resistance (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
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