Datasheet

VCON
FB
NC
SGND
BPEN
EN
VIN
SW
PGND
VCON
FB
NC
SGND
BPEN
EN
VIN
SW
PGND
LM3242
SNOSB48D –OCTOBER 2011–REVISED MARCH 2013 www.ti.com
Connection Diagrams
The actual physical placement of the package marking will vary from part to part.
Figure 1. 9-Bump Thin DSBGA Package
Large Bump (0.4 mm Pitch)
Package Number YFQ0009
PIN DESCRIPTIONS
Pin # Name Description
Voltage Control Analog input. VCON controls V
OUT
in PWM and ECO modes. VCON may also
A1 VCON
be used to force bypass condition by setting VCON > V
IN
/2.5.
A2 SGND Signal ground for analog and control circuitry.
A3 PGND Power ground for the Power MOSFETs and gate drive circuitry
Enable Input. Set this digital input high for normal operation. For shutdown, set low. Do not leave
B1 EN
EN pin floating.
B2 NC Do not connect to PGND directly — Internally connected to SGND.
Switching Node connection to the internal PFET switch and NFET synchronous rectifier. Connect
B3 SW to an inductor with a saturation current rating that exceeds the maximum Switch Peak Current
Limit specification of the LM3242.
Bypass Enable input. Set this digital input high to force bypass operation. For normal operation
C1 BPEN
with automatic bypass, set low or connect to ground. Do not leave this pin floating.
Feedback Analog Input and Bypass FET output. Connect to the output at the output filter
C2 FB
capacitor.
C3 VIN Voltage supply input for SMPS converter.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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