Datasheet

LM3241
www.ti.com SNOSB38B –JANUARY 2009–REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2)
VIN to GND −0.2V to +6.0V
EN, FB, VCON, SW (GND−0.2V) to (VIN+0.2V) w/ 6.0V
Continuous Power Dissipation Internally Limited
(3)
Junction Temperature (T
J-MAX
) +150°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature
(Soldering, 10 sec) +260°C
ESD Rating
(4)
Human Body Model: 2kV
Charged Device Model: 1250V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 125°C (typ.).
(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7)
OPERATING RATINGS
(1) (2)
Input Voltage Range 2.7V to 5.5V
Recommended Load Current 0mA to 750 mA
Junction Temperature (T
J
) Range −30°C to +125°C
Ambient Temperature (T
A
) Range −30°C to +85°C
(3)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (θ
JA
), YZR06 Package
(1)
85°C/W
(1) Junction-to-ambient thermal resistance (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
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