Datasheet

A2 VINEN A1
FB C1
VCON B1 B2 SW
C2 GND
A1 EN
C1 FB
B1 VCON
VIN A2
SW B2
GND C2
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Bottom View
LM3241
SNOSB38B –JANUARY 2009–REVISED APRIL 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Thin DSBGA Package, Large Bump (0.5 mm Pitch) (YZR06E1A)
6 Bumps
PIN DESCRIPTIONS
Pin # Name Description
A1 EN Enable Input. Set this digital input high for normal operation. For shutdown, set low. Do not leave
EN pin floating.
B1 VCON Voltage Control Analog input. VCON controls VOUT in PWM mode. Do not leave VCON pin
floating. V
OUT
= 2.5 x VCON.
C1 FB Feedback Analog Input. Connect to the output at the output inductor.
C2 GND Ground
B2 SW Switching Node connection to the internal PFET switch and NFET synchronous rectifier.
Connect to an inductor with a saturation current rating that exceeds the maximum Switch Peak
Current Limit specification of the LM3241.
A2 VIN Power supply input. Connect to the input filter capacitor (Typical Application Circuit).
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Product Folder Links: LM3241