Datasheet

LM3208
www.ti.com SNVS404B –APRIL 2006–REVISED MARCH 2013
ABSOLUTE MAXIMUM RATINGS
(1)(2)(3)
V
DD
, PV
IN
to SGND −0.2V to +6.0V
PGND to SGND −0.2V to +0.2V
EN, FB, V
CON
(SGND − 0.2V) to (V
DD
+ 0.2V) w/6.0V max
SW (PGND − 0.2V) to (PV
IN
+ 0.2V) w/6.0V max
PV
IN
to V
DD
−0.2V to +0.2V
Continuous Power Dissipation
(4)
Internally Limited
Junction Temperature (T
J-MAX
) +150°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature (Soldering, 10 sec) +260°C
ESD Rating
(5)(6)
Human Body Model 2kV
Machine Model 200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins. The LM3208 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds
2.7V.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 125°C (typ.).
(5) The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7) The machine
model is a 200pF capacitor discharged directly into each pin.
(6) TI recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling procedures
can result in damage.
OPERATING RATINGS
(1)(2)
Input Voltage Range 2.7V to 5.5V
Recommended Load Current 0mA to 650mA
Junction Temperature (T
J
) Range −30°C to +125°C
Ambient Temperature (T
A
) Range
(3)
−30°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins. The LM3208 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds
2.7V.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (θ
JA
), YZR08 Package
(1)
100°C/W
(1) Junction-to-ambient thermal resistance (θ
JA
) is taken from thermal measurements, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. A 4 layer, 4" x 4", 2/1/1/2 oz. Cu board as per JEDEC standards is used for the measurements.
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