Datasheet

ADJUST
OUTPUT
INPUT
LM317
SLVS044V –SEPTEMBER 1997–REVISED FEBRUARY 2013 www.ti.com
SCHEMATIC DIAGRAM
Absolute Maximum Ratings
(1)
over virtual junction temperature range (unless otherwise noted)
MIN MAX UNIT
V
I
– V
O
Input-to-output differential voltage 40 V
T
J
Operating virtual junction temperature 150 °C
Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Package Thermal Data
(1)
PACKAGE BOARD θ
JA
θ
JC
θ
JP
(2)
PowerFLEX™ (KTE) High K, JESD 51-5 23°C/W 11.6°C/W
SOT-223 (DCY) High K, JESD 51-7 53°C/W 30.6°C/W
TO-220 (KC/KCS/KCT) High K, JESD 51-5 19°C/W 17°C/W 3°C/W
TO-263 (KTT) High K, JESD 51-5 25.3°C/W 18°C/W 1.94°C/W
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX™, θ
JP
is defined as the thermal resistance
between the die junction and the bottom of the exposed pad.
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