Datasheet

LM2991
SNVS099H –MAY 1999–REVISED JUNE 2013 www.ti.com
Connection Diagrams
Front View Top View
Figure 1. TO-220 Package, 5-Lead Figure 2. DDPAK, TO-263 Package, 5-Lead,
Surface-Mount
See Package Number KC and NDH
See Package Number KTT
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Input Voltage −26V to +0.3V
ESD Susceptibility
(3)
2 kV
Power Dissipation
(4)
Internally limited
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 230°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(4) The maximum allowable power dissipation is a function of the maximum operating junction temperature (T
J(MAX))
, the thermal resistance
of the package (θ
JA
), and the ambient temperature (T
A
). The maximum allowable power dissipation is: P
D
= (T
J(MAX)
− T
A
)/θ
JA
, where
T
J(MAX)
is 125°C, and T
A
is the maximum expected ambient temperature. If this dissipation is exceeded, the die temperature will rise
above 125°C. Excessive power dissipation will cause the LM2991 to go into thermal shutdown (See Thermal Shutdown). For the
LM2991, the junction-to-ambient thermal resistance is 53°C/W for the TO-220, 73°C/W for the DDPAK/TO-263, and junction-to-case
thermal resistance is 3°C/W. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board
copper area thermally connected to the package. Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper
area, θ
JA
is 37°C/W; and with 1.6 or more square inches of copper area, θ
JA
is 32°C/W.
OPERATING RATINGS
(1)
Junction Temperature Range (T
J
) −40°C to +125°C
ON/OFF Pin 0V to +5V
Maximum Input Voltage (Operational) −26V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
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