Datasheet
LM2990
SNVS093D –JUNE 1999–REVISED APRIL 2013
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Connection Diagrams
Front View
Figure 1. 3-Lead TO-220 Package
See Package Number NDE0003B
Top View Side View
Figure 2. Surface-Mount DDPAK/TO-263 Package Figure 3. Surface-Mount DDPAK/TO-263 Package
See Package Number KTT0003B See Package Number KTT0003B
Top View Top View
Figure 4. 16-Lead CDIP Package Figure 5. 16-Lead CLGA Package
See Package Number NFE0016A See Package Number NAC0016A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Input Voltage −26V to +0.3V
ESD Susceptibility
(3)
2 kV
Power Dissipation
(4)
Internally Limited
Junction Temperature (T
Jmax
) 125°C
Storage Temperature −65°C to +150°C
TO-220 (T), Wave 260°C, 10 sec
Soldering Temperature
DDPAK/TO-263 (S) 235°C, 30 sec
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(4) The maximum power dissipation is a function of T
Jmax
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
Jmax
− T
A
)/θ
JA
. If this dissipation is exceeded, the die temperature will rise above 125°C, and the LM2990 will
eventually go into thermal shutdown at a T
J
of approximately 160°C. For the LM2990, the junction-to-ambient thermal resistance, is
53°C/W, 73°C/W for the DDPAK/TO-263, and the junction-to-case thermal resistance is 3°C. If the DD[AK/TO-263 package is used, the
thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package. Using 0.5 square
inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper area, θ
JA
is 37°C/W; and with 1.6 or more square inches of copper
area, θ
JA
is 32°C/W.
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