Datasheet

LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
LM2941T, LM2941S, LM2941LD 60V
Input Voltage (Survival Voltage, ≤ 100ms)
LM2941CT, LM2941CS 45V
Internal Power Dissipation
(3)
Internally Limited
Maximum Junction Temperature 150°C
Storage Temperature Range −65°C ≤ T
J
≤ +150°C
TO-220 (T), Wave 260°C, 10s
Soldering Temperature
(4)
TO-263 (S) 235°C, 30s
WSON-8 (LD) 235°C, 30s
ESD Rating
(5)
±2 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For
ensured specifications and test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J
(max) − T
A
)/θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package: Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper area, θ
JA
is
37°C/W; and with 1.6 or more square inches of copper area, θ
JA
is 32°C/W. Thermal performance for the WSON package was obtained
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θ
JA
for the WSON package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that
6 vias be placed under the center pad to improve thermal performance.
(4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperature and time are for Sn-Pb (STD) only.
(5) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. Test method is per
JESD22–A114.
Operating Ratings
Maximum Input Voltage 26V
LM2941T −40°C ≤ T
J
≤ 125°C
LM2941CT 0°C ≤ T
J
≤ 125°C
Temperature Range LM2941S −40°C ≤ T
J
≤ 125°C
LM2941CS 0°C ≤ T
J
≤ 125°C
LM2941LD −40°C ≤ T
J
≤ 125°C
Electrical Characteristics—LM2941T, LM2941S, LM2941LD
5V ≤ V
O
≤ 20V, V
IN
= V
O
+ 5V, C
O
= 22μF, unless otherwise specified. Specifications in standard typeface apply for T
J
= 25°C,
while those in boldface type apply over the full Operating Temperature Range.
LM2941T
LM2941S Units
Parameter Conditions Typ
LM2941LD (Limits)
Limit
1.237/1.211 V(min)
Reference Voltage 5mA ≤ I
O
≤ 1A
(1)
1.275
1.313/1.339 V(max)
Line Regulation V
O
+ 2V ≤ V
IN
≤ 26V, I
O
= 5mA 4 10/10 mV/V(max)
Load Regulation 50mA ≤ I
O
≤ 1A 7 10/10 mV/V(max)
100 mADC and 20 mArms
Output Impedance 7 mΩ/V
f
O
= 120Hz
V
O
+ 2V ≤ V
IN
< 26V, I
O
= 5mA 10 15/20 mA(max)
Quiescent Current
V
IN
= V
O
+ 5V, I
O
= 1A 30 45/60 mA(max)
(1) The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit.
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