Datasheet

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0
1
2
3
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5
6
POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
LM2941LD (LLP)

JA
= 35°C/W

JA
= 40°C/W

JA
= 49°C/W

JA
= 58°C/W
LM2941, LM2941C
www.ti.com SNVS770G –JUNE 1999–REVISED APRIL 2013
For the LM2941LD in the NGN 8-Lead WSON package, the junction-to-case thermal rating, θ
JC
, is 5.3°C/W,
where the CASE is defined as the bottom of the package at the center of the DAP area. The junction-to-ambient
thermal performance for the LM2941LD in the NGN 8-Lead WSON package, using the JEDEC JESD51
standards is summarized in the following table:
Board Thermal
θ
JC
θ
JA
Type Vias
JEDEC
2-Layer None 5.3°C/W 181°C/W
JESD 51-3
1 5.3°C/W 58°C/W
JEDEC
2 5.3°C/W 49°C/W
4-Layer
4 5.3°C/W 40°C/W
JESD 51-7
6 5.3°C/W 35°C/W
Figure 22. PD
(MAX)
vs T
A
for LM2941LD (WSON)
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Product Folder Links: LM2941 LM2941C