Datasheet

LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013 www.ti.com
Electrical Characteristics—LM2941CT, LM2941CS (continued)
5V ≤ V
O
≤ 20V, V
IN
= V
O
+ 5V, C
O
= 22μF, unless otherwise specified. Specifications in standard typeface apply for T
J
= 25°C,
while those in boldface type apply over the full Operating Temperature Range.
Limit Units
Parameter Conditions Typ
(1)
(Limits)
Maximum Line V
O
Max 1V Above Nominal V
O
55 45 V(min)
Transient R
O
= 100Ω, T ≤ 100ms
Maximum Operational
31 26 V
DC
Input Voltage
Reverse Polarity
R
O
= 100Ω, V
O
≥ −0.6V −30 −15 V(min)
DC Input Voltage
Reverse Polarity
T ≤ 100ms, R
O
= 100Ω −55 −45 V(min)
Transient Input Voltage
ON/OFF Threshold
I
O
≤ 1A 1.30 0.80 V(max)
Voltage ON
ON/OFF Threshold
I
O
≤ 1A 1.30 2.00 V(min)
Voltage OFF
ON/OFF Threshold
V
ON/OFF
= 2.0V, I
O
≤ 1A 50 100 μA(max)
Current
Thermal Performance
Thermal Resistance 5-Lead TO-220 1 °C/W
Junction-to-Case, θ
JC
5-Lead TO-263 1 °C/W
8-Lead WSON 5.3 °C/W
Thermal Resistance 5-Lead TO-220 53 °C/W
Junction-to-Ambient, θ
JA
(1)
5-Lead TO-263 (See TO-263 Mounting) 73 °C/W
8-Lead WSON (See WSON Mounting) 35 °C/W
(1) The maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J
(max) − T
A
)/θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package: Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper area, θ
JA
is
37°C/W; and with 1.6 or more square inches of copper area, θ
JA
is 32°C/W. Thermal performance for the WSON package was obtained
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θ
JA
for the WSON package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that
6 vias be placed under the center pad to improve thermal performance.
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