Datasheet

LM2940-N, LM2940C
www.ti.com SNVS769I –MARCH 2000–REVISED APRIL 2013
Figure 39. θ
(JA)
vs. Copper (2 ounce) Area for the SOT-223 Package
Figure 40. Maximum Power Dissipation vs. T
A
for the SOT-223 Package
HEATSINKING WSON PACKAGE PARTS
The value of θ
JA
for the WSON package is specifically dependent on PCB trace area, trace material, and the
number of layers and thermal vias. It is recommended that a minimum of 6 thermal vias be placed under the
center pad to improve thermal performance.
For techniques for improving the thermal resistance and power dissipation for the WSON package, please refer
to Application Note AN-1187 (SNOA401).
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