Datasheet

GND
INPUT
N/C
GND
1
3
4
2
6
5
7
8
GND
N/C
V
OUT
V
OUT
N/C
LM2940-N, LM2940C
SNVS769H –MAY 2004–REVISED MARCH 2007 www.ti.com
Figure 3. Top View - 16-Lead Dual-in-Line Package (J)
Figure 4. Top View - 16-Lead Ceramic Surface-Mount Package (WG)
Figure 5. Top View - TO-263 (S) Surface-Mount Package
Figure 6. Side View
Pin 2 and pin 7 are fused to center DAP
Pin 5 and 6 need to be tied together on PCB board
Figure 7. Top View - LLP (LD) 8-Lead
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Links: LM2940-N LM2940C