Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM193DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2903DR SOIC D 8 2500 340.5 338.1 20.6
LM2903DR SOIC D 8 2500 367.0 367.0 35.0
LM2903DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2903DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2903DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903PSR SO PS 8 2000 367.0 367.0 38.0
LM2903PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2903PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2903PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2903QDRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2903VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM293ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293ADR SOIC D 8 2500 367.0 367.0 35.0
LM293ADR SOIC D 8 2500 340.5 338.1 20.6
LM293ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM293ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM293DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM293DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Oct-2013
Pack Materials-Page 3