Datasheet

LM2937
SNVS100E –MARCH 2000–REVISED APRIL 2013 www.ti.com
Figure 27. Maximum Power Dissipation vs. T
AMB
for the DDPAK/TO-263 Package
Figure 28 and Figure 29 show the information for the SOT-223 package. Figure 29 assumes a θ
(J−A)
of 74°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C.
Figure 28. θ
(J−A)
vs Copper (2 ounce) Area for the Figure 29. Maximum Power Dissipation vs T
AMB
for
SOT-223 Package the SOT-223 Package
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed
circuit board. The excessive temperatures involved may cause package cracking.
Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223
package.
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