Datasheet

LM2937-2.5, LM2937-3.3
www.ti.com SNVS015E –FEBRUARY 1998–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Line Transient Response Load Transient Response
Figure 11. Figure 12.
Ripple Rejection Output Impedance
Figure 13. Figure 14.
Maximum Power Dissipation (TO-220) Maximum Power Dissipation (DDPAK/TO-263)
(1)
Figure 15. Figure 16.
(1) The maximum allowable power dissipation at any ambient temperature is P
MAX
= (125 − T
A
)/θ
JA
, where 125 is the maximum junction
temperature for operation, T
A
is the ambient temperature, and θ
JA
is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θ
JA
is 65°C/W, for the TO-220 package,
73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θ
JA
is the sum of the
device junction-to-case thermal resistance θ
JC
of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or
SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to
the package (see Application Hints for more information on heatsinking).
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