Datasheet
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2936QDTX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936QDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936QDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936QHBMAX5.0/NOP
B
SOIC D 8 2500 367.0 367.0 35.0
LM2936QMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936QMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936QMM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936QMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936QMMX-5.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936QMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936QMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936QMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936QMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 2