Datasheet

PGND

PVIN

NC NC

AVIN

AGND

EXP

LM2854

SNVS560C –MARCH 2008–REVISED APRIL 2013

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Connection Diagram

Figure 1. 16-Lead HTSSOP – Top View

See Package Number PWP

PIN DESCRIPTIONS

Pin Number Name Description

1 NC Reserved for factory use, this pin should be connected to GND to ensure proper operation.

2,3,4 PGND Power ground pins for the internal power switches. These pins should be connected together locally at the

device and tied to the PC board ground plane.

5,6,7 PVIN Input voltage to the power switches inside the device. These pins should be connected together at the device.

A low ESR input capacitance should be located as close as possible to these pins.

8,9 NC Reserved for factory use, these pins should be connected to GND to ensure proper operation.

10 AVIN Analog input voltage supply that generates the internal bias. The UVLO circuit derives its input from this pin

also. Thus, if the voltage on AVIN falls below the UVLO threshold, both internal FETs are turned off. It is

recommended to connect PVIN to AVIN through a low pass RC filter to minimize the influence of input rail

ripple and noise on the analog control circuitry. The series resistor should be 1Ω and the bypass capacitor

should be a X7R ceramic type 0.1 µF to 1.0 µF.

11 EN Active high enable input for the device. Typically, turn-on threshold is 1.23V with 0.15V hysteresis. An

external resistor divider from PVIN can be used to effectively increase the UVLO turn-on threshold. If not

used, the EN pin should be connected to PVIN.

12,13 SW Switch node pins. This is the PWM output of the internal MOSFET power switches. These pins should be tied

together locally and connected to the filter inductor.

14 SS Soft-start control pin. An internal 2 µA current source charges an external capacitor connected between this

pin and AGND to set the output voltage ramp rate during startup. This pin can also be used to configure the

tracking feature.

15 AGND Quiet analog ground for the internal bias circuitry.

16 FB Feedback pin is connected to the inverting input of the voltage loop error amplifier. A 0.8V bandgap reference

is connected to the non-inverting input of the error amplifier.

EXP Exposed Exposed metal pad on the underside of the package with a weak electrical connection to PGND. It is

Pad recommended to connect this pad to the PC board ground plane in order to improve thermal dissipation.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM2854