Datasheet

1
2
3
4
EN
SGND
SW
SW
VIND
VIND
5
PGND
NC
FB
VINC
6
7
8
9
10
8
7
6
5
DAP
2
3
4
7
9
8
VIND
EN
NC
DAP
SW
SW
SGND
6
10
1
5
FB
PGND
VINC
VIND
LM2833
V
IN
VIND
SW
FB
SGND
L1
R1
D1
C1
V
OUT
VINC
PGND
C2
R2
EN
1
2
3 6
5
7,8
9,10
R3
C3
4
NC
LM2833
SNVS505E –MAY 2008–REVISED APRIL 2013 www.ti.com
Typical Application Circuit
Connection Diagrams
Figure 1. 10-Pin WSON Figure 2. 10-pin MSOP-PowerPAD
See Package DSC See Package DGQ
PIN DESCRIPTIONS
Pin(s) Name Description
1 VINC Input supply for internal bias and control circuitry. Need to locally bypass this pin to GND.
Enable control input. Logic high enables operation. Do not allow this pin to float or subject to
2 EN
voltages greater than V
IN
+ 0.3V.
Signal (analog) ground. Place the bottom resistor of the feedback network as close as possible to
3 SGND
this pin for good load regulation.
4 NC No user function, connect this pin to GND.
5 FB Feedback pin. Connect this pin to the external resistor divider to set output voltage.
6 PGND Power ground pin. Provides ground return path for the internal driver.
7, 8 SW Switch pins. Connect these pins to the inductor and catch diode.
9, 10 VIND Input supply voltage. Connect a bypass capacitor locally from these pins to PGND.
Connect to system ground for low thermal impedance, but it cannot be used as a primary GND
DAP Die Attach Pad
connection.
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