Datasheet
R
T
JA
=
T
J
- T
A
Power
R
T
=
'T
Power
LM2831
www.ti.com
SNVS422C –AUGUST 2006–REVISED APRIL 2013
Typical Application power losses are:
Table 1. Power Loss Tabulation
V
IN
5.0V
V
OUT
3.3V P
OUT
4.125W
I
OUT
1.25A
V
D
0.45V P
DIODE
188mW
F
SW
550kHz
I
Q
2.5mA P
Q
12.5mW
T
RISE
4nS P
SWR
7mW
T
FALL
4nS P
SWF
7mW
R
DS(ON)
150mΩ P
COND
156mW
IND
DCR
70mΩ P
IND
110mW
D 0.667 P
LOSS
481mW
η 88% P
INTERNAL
183mW
ΣP
COND
+ P
SW
+ P
DIODE
+ P
IND
+ P
Q
= P
LOSS
(27)
ΣP
COND
+ P
SWF
+ P
SWR
+ P
Q
= P
INTERNAL
(28)
P
INTERNAL
= 183mW (29)
Thermal Definitions
T
J
Chip junction temperature
T
A
Ambient temperature
R
θJC
Thermal resistance from chip junction to device case
R
θJA
Thermal resistance from chip junction to ambient air
Heat in the LM2831 due to internal power dissipation is removed through conduction and/or convection.
Conduction Heat transfer occurs through cross sectional areas of material. Depending on the material, the
transfer of heat can be considered to have poor to good thermal conductivity properties (insulator vs.
conductor).
Heat Transfer goes as:
Silicon → package → lead frame → PCB
Convection: Heat transfer is by means of airflow. This could be from a fan or natural convection. Natural
convection occurs when air currents rise from the hot device to cooler air.
Thermal impedance is defined as:
(30)
Thermal impedance from the silicon junction to the ambient air is defined as:
(31)
The PCB size, weight of copper used to route traces and ground plane, and number of layers within the PCB can
greatly effect R
θJA
. The type and number of thermal vias can also make a large difference in the thermal
impedance. Thermal vias are necessary in most applications. They conduct heat from the surface of the PCB to
the ground plane. Four to six thermal vias should be placed under the exposed pad to the ground plane if the
WSON package is used.
Thermal impedance also depends on the thermal properties of the application operating conditions (Vin, Vo, Io
etc), and the surrounding circuitry.
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