Datasheet

LM2757
www.ti.com SNVS536E –OCTOBER 2007–REVISED MAY 2013
Absolute Maximum Ratings
(1)(2)(3)
V
IN
Pin: Voltage to GND -0.3V to 6.0V
M0, M1 pins: Voltage to GND -0.3V to 6.0V
Continuous Power Dissipation Internally Limited
(4)
Junction Temperature (T
J-MAX
) 150ºC
Storage Temperature Range -65ºC to +150º C
Maximum Lead Temperature 265ºC
(Soldering, 10 sec.)
ESD Rating
(5)
Human Body Model: 2.5 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) All voltages are with respect to the potential at the GND pins.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
=145°C (typ.) and
disengages at T
J
=135°C (typ.).
(5) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Operating Ratings
(1)(2)
Input Voltage Range 2.7V to 5.5V
Junction Temperature (T
J
) Range -30°C to +110°C
Ambient Temperature (T
A
) Range
-30°C to +85°C
(3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
JMAX-
OP
=125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to-ambient thermal resistance of
the part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
Thermal Properties
Junction-to-Ambient Thermal 75°C/W
Resistance (θ
JA
), DSBGA Package
(1)
(1) Junction-to-ambient thermal resistance (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. The test board is a 4–layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array
of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5 oz./1
oz./1 oz./1.5 oz.). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. The value of θ
JA
in LM2757 in DSBGA-12
could fall in a range as wide as 50°C/W to 150°C/W (if not wider), depending on PWB material, layout and environmental conditions. In
applications where high maximum power dissipation exists (high V
IN
, high I
OUT
), special care must be paid to thermal dissipation issues.
For more information on these topics, please refer to Application Note 1112: Micro SMD Wafer Level Chip Scale Package (µSMD).
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