Datasheet

LM2738
www.ti.com SNVS556B –APRIL 2008–REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1)(2)
V
IN
, V
CC
-0.5V to 24V
SW Voltage -0.5V to 24V
Boost Voltage -0.5V to 30V
Boost to SW Voltage -0.5V to 6.0V
FB Voltage -0.5V to 3.0V
EN Voltage -0.5V to (V
IN
+ 0.3V)
Junction Temperature 150°C
ESD Susceptibility
(3)
2kV
Storage Temp. Range -65°C to 150°C
Soldering Information Infrared/Convection Reflow (15sec) 220°C
Wave Soldering Lead Temp. (10sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
OPERATING RATINGS
(1)
V
IN
, V
CC
3V to 20V
SW Voltage -0.5V to 20V
Boost Voltage -0.5V to 25.5V
Boost to SW Voltage 2.5V to 5.5V
Junction Temperature Range −40°C to +125°C
Thermal Resistance θ
JA
for WSON/MSOP-PowerPAD
(2)
60°C/W
Thermal Shutdown
(2)
165°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see Electrical Characteristics.
(2) Typical thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
= (T
J(MAX)
– T
A
)/θ
JA
. All numbers apply for
packages soldered directly onto a 3” x 3” PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal
resistance varies greatly with layout, copper thicknes, number of layers in PCB, power distribution, number of thermal vias, board size,
ambient temperature, and air flow.
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