Datasheet

1
3
6
5
4
SW
V
IN
EN
2
BOOST
GND
FB
LM2734Z
www.ti.com SNVS334E –JANUARY 2005–REVISED APRIL 2013
WSON PACKAGE
The LM2734Z is packaged in a Thin SOT-6 package and the 6–pin WSON. The WSON package has the same
footprint as the Thin SOT-6, but is thermally superior due to the exposed ground paddle on the bottom of the
package.
Figure 14. No Pullback WSON Configuration
R
θJA
of the WSON package is normally two to three times better than that of the Thin SOT-6 package for a
similar PCB configuration (area, copper weight, thermal vias).
Figure 15. Dog Bone
For certain high power applications, the PCB land may be modified to a "dog bone" shape (see Figure 15). By
increasing the size of ground plane, and adding thermal vias, the R
θJA
for the application can be reduced.
Design Example 4:
Operating Conditions
Package WSON-6
V
IN
12.0V P
OUT
2.475W
V
OUT
3.3V P
DIODE
523mW
I
OUT
750mA P
IND
56.25mW
V
D
0.35V P
SWF
108mW
Freq 3MHz P
SWR
108mW
I
Q
1.5mA P
COND
68.2mW
I
BOOST
4mA P
Q
18mW
V
BOOST
5V P
BOOST
20mW
T
RISE
8ns P
LOSS
902mW
T
FALL
8ns
R
DSON
400mΩ
IND
DCR
75mΩ
D 30.3%
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