Datasheet

LM2734
www.ti.com SNVS288I –SEPTEMBER 2004–REVISED APRIIL 2013
Absolute Maximum Ratings
(1)(2)
V
IN
-0.5V to 24V
SW Voltage -0.5V to 24V
Boost Voltage -0.5V to 30V
Boost to SW Voltage -0.5V to 6.0V
FB Voltage -0.5V to 3.0V
EN Voltage -0.5V to (V
IN
+ 0.3V)
Junction Temperature 150°C
ESD Susceptibility
(3)
2kV
Storage Temp. Range -65°C to 150°C
Soldering Information Reflow Peak Pkg. Temp.(15sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specific specifications and the test conditions,
see Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
Operating Ratings
(1)
V
IN
3V to 20V
SW Voltage -0.5V to 20V
Boost Voltage -0.5V to 25V
Boost to SW Voltage 1.6V to 5.5V
Junction Temperature Range −40°C to +125°C
Thermal Resistance θ
JA
(2)
118°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specific specifications and the test conditions,
see Electrical Characteristics.
(2) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
= (T
J(MAX)
– T
A
)/θ
JA
. All numbers apply for
packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still
air, θ
JA
= 204°C/W.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM2734