Datasheet

formula: . If power dissipation exceeds the maximum specified above, the internal thermal protection

TI Confidential - NDA Restrictions

LM2731

www.ti.com

SNVS217F –MAY 2004–REVISED NOVEMBER 2012

PIN DESCRIPTIONS

Pin Name Function

1 SW Drain of the internal FET switch.

2 GND Analog and power ground.

3 FB Feedback point that connects to external resistive divider.

4 SHDN Shutdown control input. Connect to Vin if the feature is not used.

5 V

Analog and power input.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

Storage Temperature Range −65°C to +150°C

Operating Junction Temperature Range −40°C to +125°C

Lead Temp. (Soldering, 5 sec.) 300°C

Power Dissipation

(2)

Internally Limited

FB Pin Voltage −0.4V to +6V

SW Pin Voltage −0.4V to +22V

Input Supply Voltage −0.4V to +14.5V

SHDN Pin Voltage −0.4V to VIN + 0.3V

(SOT23-5) 265°C/W

ESD Rating

(3)

Human Body Model 2 kV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of the limits set forth under the operating ratings which specify the intended range of operating

conditions.

(2) The maximum power dissipation which can be safely dissipated for any application is a function of the maximum junction temperature,

(MAX) = 125°C, the junction-to-ambient thermal resistance for the SOT-23 package, θ

J-A

= 265°C/W, and the ambient temperature,

. The maximum allowable power dissipation at any ambient temperature for designs using this device can be calculated using the

circuitry will protect the device by reducing the output voltage as required to maintain a safe junction temperature.

(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.

Product Folder Links: LM2731