Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers PWM High side, Low side, Sychronous SOIC 8

GND

VCC

PWM_IN

CBOOT

LM2725/ LM2726

0.1U

(up to 35V)

out

PWM

SIGNAL

out

Note: for ultra low-frequency operation (such as

skip mode at light load), D

should be a fast

recovery type diode instead of a Schottky.

LM2725, LM2726

www.ti.com

SNVS144D –NOVEMBER 2000–REVISED MARCH 2013

LM2725/LM2726 High Speed Synchronous MOSFET Drivers

Check for Samples: LM2725, LM2726

FEATURES

DESCRIPTION

The LM2725/LM2726 is a family of dual MOSFET

• High Peak Output Current

drivers that drive both the top MOSFET and bottom

• Adaptive Shoot-Through Protection

MOSFET in a push-pull structure simultaneously. It

• 36V SW Pin Absolute Maximum Voltage

takes a logic level PWM input and splits it into two

complimentary signals with a typical 20ns dead time

• Input Under-Voltage-Lock-Out

in between. The built-in shoot-through protection

• Typical 20ns Internal Delay

circuitry prevents the top and bottom FETs from

• Plastic 8-pin SOIC Package

turning on simultaneously. With a bias voltage of 5V,

the peak sourcing and sinking current for each driver

APPLICATIONS

of the LM2725 is about 1.2A and that of the LM2726

is about 3A. In an SOIC-8 package, each driver is

• High Current DC/DC Power Supplies

able to handle 50mA average current. When EN

• High Input Voltage Switching Regulators

signal is asserted the input UVLO (Under Voltage

Lock Out) ensures that all the driver outputs stay low

• Microprocessors

until the supply rail exceeds the power-on threshold

during system power on, or after the supply rail drops

below power-on threshold by a specified hysteresis

during system power down. The cross-conduction

protection circuitry detects both the driver outputs and

will not turn on a driver until the other driver output is

low. The top gate bias voltage needed by the top

MOSFET can be obtained through an external

bootstrap structure. Minimum input pulse width is as

low as 55ns.

Typical Application

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (16 pages)

PAGE 1
LM2725, LM2726 www.ti.com SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 LM2725/LM2726 High Speed Synchronous MOSFET Drivers Check for Samples: LM2725, LM2726 FEATURES DESCRIPTION • • • • • • The LM2725/LM2726 is a family of dual MOSFET drivers that drive both the top MOSFET and bottom MOSFET in a push-pull structure simultaneously. It takes a logic level PWM input and splits it into two complimentary signals with a typical 20ns dead time in between.
PAGE 2
LM2725, LM2726 SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 www.ti.com Connection Diagram 8-Lead Small Outline Package SW 1 8 GND HG 2 7 LG CBOOT 3 6 VCC PWM_IN 4 5 EN Figure 1. Top View PIN DESCRIPTIONS Pin Name 1 SW Top driver return. Should be connected to the common node of top and bottom FETs. 2 HG Top gate drive output. 3 CBOOT Bootstrap. Accepts a bootstrap voltage for powering the high-side driver. 4 PWM_IN Accepts a 5V-logic control signal.
PAGE 3
LM2725, LM2726 www.ti.com SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
PAGE 4
LM2725, LM2726 SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 www.ti.com Electrical Characteristics LM2725 VCC = CBOOT = 5V, SW = GND = 0V, unless otherwise specified. Typicals and limits appearing in plain type apply for TA = TJ = +25°C. Limits appearing in boldface type apply over the entire operating temperature range. Symbol Parameter Condition Min Typ Max Units POWER SUPPLY Iq_op Operating Quiescent Current PWM_IN = 0V 180 250 µA Iq_sd Shutdown Quiescent Current EN = 0V, PWM_IN = 0V 0.
PAGE 5
LM2725, LM2726 www.ti.com SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 Electrical Characteristics LM2725 (continued) VCC = CBOOT = 5V, SW = GND = 0V, unless otherwise specified. Typicals and limits appearing in plain type apply for TA = TJ = +25°C. Limits appearing in boldface type apply over the entire operating temperature range. Condition Min VIH_PWM Symbol PWM_IN High Level Input Voltage Parameter When PWM_IN pin goes high from 0V 2.
PAGE 6
LM2725, LM2726 SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 www.ti.com Electrical Characteristics LM2726 (continued) VCC = CBOOT = 5V, SW = GND = 0V, unless otherwise specified. Typicals and limits appearing in plain type apply for TA = TJ = +25°C. Limits appearing in boldface type apply over the entire operating temperature range.
PAGE 7
LM2725, LM2726 www.ti.com SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 Test Circuits 3 5 Vbias 6 4 CBOOT HG EN LG VCC SW PWM_IN GND 2 7 VX R 1 8 Width = 200ns, One Shot. Figure 4. Test Circuit 1 3 5 Vbias 6 4 CBOOT HG EN LG VCC PWM_IN SW GND 2 7 VX R 1 8 Vbias Width = 200ns, One Shot. Figure 5. Test Circuit 2 3 5 Vbias 6 4 CBOOT LG EN HG VCC SW PWM_IN GND 7 2 VX R 1 8 Width = 200ns, One Shot. Figure 6.
PAGE 8
LM2725, LM2726 SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 Ipull_up = www.ti.com Vx R Ipull_down = (1) Vbias - Vx R (2) Vbias - Vx Rds_pull_up = .R Vx (3) Rds_pull_down = Vx .R Vbias - Vx (4) Typical Waveforms 8 Figure 8. Switching Waveforms of Test Circuit Figure 9. When Input Goes High Figure 10. When Input Goes Low Figure 11. Minimum Positive Pulse Figure 12. Turn-Off Figure 13.
PAGE 9
LM2725, LM2726 www.ti.com SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 Functional Description The LM2725/2726 drivers were designed to be used in systems supporting low-power states, such as notebook computers’ Suspend-To-RAM (STR), etc. A typical application scenario would be powering up and powering down the driver while having EN asserted, i.e. at logic high level.
PAGE 10
LM2725, LM2726 SNVS144D – NOVEMBER 2000 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................
PAGE 11
PACKAGE OPTION ADDENDUM www.ti.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2726MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2726MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2726MX SOIC D 8 2500 367.0 367.0 35.0 LM2726MX/NOPB SOIC D 8 2500 367.0 367.0 35.
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