Datasheet
LM2700
SNVS152C –MAY 2001–REVISED MARCH 2013
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LAYOUT CONSIDERATIONS
The LM2700 uses two separate ground connections, PGND for the driver and NMOS power device and AGND
for the sensitive analog control circuitry. The AGND and PGND pins should be tied directly together at the
package. The feedback and compensation networks should be connected directly to a dedicated analog ground
plane and this ground plane must connect to the AGND pin. If no analog ground plane is available then the
ground connections of the feedback and compensation networks must tie directly to the AGND pin. Connecting
these networks to the PGND can inject noise into the system and effect performance.
The input bypass capacitor C
IN
, as shown in Figure 19, must be placed close to the IC. This will reduce copper
trace resistance which effects input voltage ripple of the IC. For additional input voltage filtering, a 100nF bypass
capacitor can be placed in parallel with C
IN
, close to the V
IN
pin, to shunt any high frequency noise to ground.
The output capacitor, C
OUT
, should also be placed close to the IC. Any copper trace connections for the C
OUT
capacitor can increase the series resistance, which directly effects output voltage ripple. The feedback network,
resistors R
FB1
and R
FB2
, should be kept close to the FB pin, and away from the inductor, to minimize copper
trace connections that can inject noise into the system. Trace connections made to the inductor and schottky
diode should be minimized to reduce power dissipation and increase overall efficiency. For more detail on
switching power supply layout considerations see Application Note AN-1149: Layout Guidelines for Switching
Power Supplies (literature number SNVA021).
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