Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2674LD-3.3/NOPB WSON NHN 16 1000 213.0 191.0 55.0
LM2674LD-ADJ/NOPB WSON NHN 16 1000 213.0 191.0 55.0
LM2674LDX-5.0/NOPB WSON NHN 16 4500 367.0 367.0 35.0
LM2674MX-12/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2674MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2674MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2674MX-ADJ/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2