Datasheet

LM2651
SNVS032D –FEBRUARY 2000–REVISED APRIL 2013 www.ti.com
Connection Diagram
Figure 3. 16-Lead TSSOP
See Package Number PW
PIN DESCRIPTIONS
Pin Name Function
1, 2 SW Switched-node connection, which is connected with the source of the internal high-side MOSFET.
3-5 VIN Main power supply pin.
6 VCB Bootstrap capacitor connection for high-side gate drive.
7 AVIN Input supply voltage for control and driver circuits.
8 SD(SS) Shutdown and Soft-start control pin. Pulling this pin below 0.3V shuts off the regulator. A capacitor
connected from this pin to ground provides a control ramp of the input current. Do not drive this pin
with an external source or erroneous operation may result.
9 FB Output voltage feedback input. Connected to the output voltage.
10 COMP Compensation network connection. Connected to the output of the voltage error amplifier.
11 NC No internal connection.
12-13 AGND Low-noise analog ground.
14-16 PGND Power ground.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Input Voltage 15V
Feedback Pin Voltage −0.4V ≤ V
FB
≤ 5V
Power Dissipation (T
A
=25°C),
(3)
893 mW
Junction Temperature Range −40°C ≤ T
J
≤ +125°C
Storage Temperature Range −65°C to +150°C
ESD Susceptibility Human Body Model
(4)
1kV
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which
the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For
specifications and test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum allowable power dissipation is calculated by using P
Dmax
= (T
Jmax
− T
A
)/θ
JA
, where T
Jmax
is the maximum junction
temperature, T
A
is the ambient temperature, and θ
JA
is the junction-to-ambient thermal resistance of the specified package. The 893
mW rating results from using 150°C, 25°C, and 140°C/W for T
Jmax
, T
A
, and θ
JA
respectively. A θ
JA
of 140°C/W represents the worst-
case condition of no heat sinking of the 16-pin TSSOP package. Heat sinking allows the safe dissipation of more power. The Absolute
Maximum power dissipation must be derated by 7.14mW per °C above 25°C ambient. The LM2651 actively limits its junction
temperature to about 165°C.
(4) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
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