Datasheet

LM26484
SNVS573F –SEPTEMBER 2008–REVISED MARCH 2013 www.ti.com
Absolute Maximum Ratings
(1)(2)(3)
VIN1, VIN2, AVDD, AVIN −0.3V to +6V
nPOR, ENSW1, FB1, ENSW2, FB2, ENLDO, LDO_FB −0.3 to VIN + 0.3V
GND to GND SLUG ±0.3V
Junction Temperature (T
J-MAX
) 150°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature (Soldering) 260°C
ESD Ratings
Human Body Model
(4)
2 kV
Machine Model:
VIN1,2; SW1,2 PGND1,2 150V
All other pins 200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. (MILSTD - 883 3015.7)
Operating Ratings
VIN1, VIN2, AVDD, AVIN 3.0V to 5.5V
nPOR, ENSW1, ENSW2, ENLDO, LDO_GATE, SW1, SW2 0V to V
IN
+ 0.3V
FB1, FB2 0v to VBuck1 and VBuck2 respectively
LDOFB 0v to V
LDO
Power Dissipation (P
D-MAX
) 1.2W
T
A
= 85°C, T
MAX
= 125°C
Junction Temperature (T
J
) Range
(1)
−40°C to +125°C
(1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 160°C (typ.) and
disengages at T
J
= 130°C (typ.)
Thermal Properties
(1) (2)
Junction-to-Ambient 33.1°C/W based on a
Thermal Resistance 4-layer 1 oz. PCB
(θ
JA
)
Junction-to-Case 4.3°C/W
Thermal Resistance (θ
JC
)
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature, the
maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to-ambient thermal resistance of the package in
the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX
− (θ
JA
× P
D-MAX
).Refer to dissipation rating table for P
D-MAX
values at different ambient temperatures.
(2) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. More information is available in Application
Note AN-1187 (SNOA401).
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