Datasheet

LM26480
www.ti.com SNVS543I –JANUARY 2008–REVISED MAY 2013
Table 2. PIN DESCRIPTIONS
(1)
(continued)
WQFN Pin
Name I/O Type Description
No.
14 SW2 O PWR Buck2 switcher output pin
15 GND_SW2 G G Buck2 NMOS
16 ENLDO2 I D LDO2 enable pin, a logic HIGH enables LDO2. Pin cannot be left floating.
17 ENLDO1 I D LDO1 enable pin, a logic HIGH enables LDO1. Pin cannot be left floating.
18 GND_L G G LDO ground
19 VINLDO1 I PWR Power in from either DC source or battery to LDO1
20 LDO1 O PWR LDO1 Output
21 FBL1 I A LDO1 Feedback Terminal
22 FBL2 I A LDO2 Feedback Terminal
23 LDO2 O PWR LDO Output
24 VINLDO2 I PWR Power in from either DC source or battery to LDO2.
DAP DAP GND GND Connection isn't necessary for electrical performance, but it is recommended for
better thermal dissipation.
Power Block Operation
(1)
Note
Power Block Input Enabled Disabled
VINLDO12 VIN+ VIN+ Always Powered
AVDD VIN+ VIN+ Always Powered
VIN1 VIN+ VIN+ or 0V
VIN2 VIN+ VIN+ or 0V
VINLDO1 ≤ VIN+ ≤ VIN+ If Enabled, Min VIN is 1.74V
VINLDO2 ≤ VIN+ ≤ VIN+ If Enabled, Min VIN is 1.74V
(1) VIN+ is the largest potential voltage on the device.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
VINLDO12, VIN1, AVDD, VIN2, VINLDO1, VINLDO2, ENSW1, FB1, FB2,
ENSW2, ENLDO1, ENLDO2, SYNC, FBL1, FBL2 −0.3V to +6V
GND to GND SLUG ±0.3V
Power Dissipation (P
D_MAX
)
(T
A
=85°C, T
MAX
=125°C )
(4)
1.17W
Junction Temperature (T
J-MAX
) 150°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature (Soldering) 260°C
ESD Ratings
Human Body Model
(5)
2 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For performance limits and
associated test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) All voltages are with respect to the potential at the GND pin.
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to-ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
− (θ
JA
× P
D-MAX
). See Application Notes.
(5) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MILSTD - 883 3015.7)
Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM26480