Datasheet

LM26400Y
SNVS457C –FEBRUARY 2007–REVISED APRIL 2013 www.ti.com
Electrical Characteristics
Unless otherwise stated, the following conditions apply: AVIN = PVIN = V
IN
= 5V. Limits in standard type are for T
J
= 25°C
only; limits in boldfacetype apply over the junction temperature (T
J
) range of -40°C to 125°C. Minimum and Maximum limits
are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T
J
=
25°C, and are provided for reference purposes only.
Symbol Parameter Conditions Min Typ Max Units
0°C to 85°C. Feedback Loop 0.591 0.6 0.611
Closed.
V
FB
Voltages at FB1 and FB2 Pins V
-40°C to 125°C. Feedback 0.585 0.617
Loop V Closed.
ΔV
FB_Line
Line Regulation of FB1 and FB2 Voltages, V
IN
= 3V to 20V 66 ppm/V
Expressed as PPM Change Per Volt of V
IN
Variation
I
FB
Current in FB1 and FB2 Pins V
FB
= 0.6V 0.4 250 nA
V
IN
Rising From 0V 2.7 2.9 V
V
UVLO
Under Voltage Lockout Threshold
V
IN
Falling From 3.3V 2.0 2.3
V
UVLO_HYS
UVLO Hysteresis 0.2 0.36 0.55 V
F
SW
Switching Frequency 0.39 0.52 0.65 MHz
D
MAX
Maximum Duty Cycle 90 96 %
D
MIN
Minimum Duty Cycle 2 %
HTSSOP, 2A Drain Current 175 320
R
DS(ON)
ON Resistance of Internal Power MOSFET mΩ
WSON, 2A Drain Current 194 350
I
CL
Peak Current Limit of Internal MOSFET 2.5 3 4.5 A
I
SD
Shutdown Current of AVIN Pin EN1 = EN2 = 0V 2 nA
I
Q
Quiescent Current of AVIN Pin (both EN1 = EN2 = 5V, FB1 = FB2 4 mA
channels are enabled but not switching) = 0.7V
V
EN_IH
Input Logic High of EN1 and EN2 Pins 2.5 V
V
EN_IL
Input Logic Low of EN1 and EN2 Pins 0.4 V
I
EN
EN1 and EN2 Currents (sink or source) 5 nA
I
SW_LEAK
Switch Leakage Current Measured at SW1 EN1 = EN2 = SWx = 0 1 µA
and SW2 Pins
ΔΦ Phase Shift Between SW1 and SW2 Rising Feedback Loop Closed. 170 180 19 deg
Edges Continuous Conduction
Mode.
I
SS
SSx Pin Current 11 16 21 µA
ΔI
SS
Difference Between SS1 and SS2 Currents 3 µA
V
FB_F
FB1 and FB2 Frequency Fold-back 0.35 V
Threshold
Thermal Characteristics
Typical Value
Symbol Description Conditions Unit
HTSSOP WSON
Junction-to-Ambient Thermal Mount package on a standard board
(2)
and test
θ
JA
28 26
Resistance
(1)
per JESD51-7 standard.
°C/W
Junction-to-Case-Bottom
θ
JC
3 2.8
Thermal Resistance
T
SD
Thermal Shutdown Threshold Junction temperature rises. 165
°C
T
SD_HYS
Thermal Shutdown Hysteresis Junction temperature falls from above T
SD
. 15
(1) Value is highly board-dependent. For comparison of package thermal performance only. Not recommended for prediction of junction
temperature in real applications. See THERMAL CONSIDERATIONS for more information.
(2) A standard board refers to a four-layer PCB with the size 4.5”x3”x0.063”. Top and bottom copper is 2 oz. Internal plane copper is 1 oz.
For details refer to JESD51-7 standard.
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