Datasheet

LM2622
www.ti.com SNVS068E –MAY 2000–REVISED MARCH 2013
Electrical Characteristics (continued)
Specifications in standard type face are for T
J
= 25°C and those with boldface type apply over the full Operating
Temperature Range ( T
J
= −40°C to +125°C)Unless otherwise specified. V
IN
=2.0V and I
L
= 0A, unless otherwise specified.
Min Typ Max
Symbol Parameter Conditions Units
(1) (2) (1)
V
IN
Input Voltage Range 2 12 V
g
m
Error Amp Transconductance ΔI = 5µA 40 135 290 µmho
A
V
Error Amp Voltage Gain 135 V/V
D
MAX
Maximum Duty Cycle 78 85 %
f
S
Switching Frequency FSLCT = Ground 480 600 720 kHz
FSLCT = V
IN
1 1.25 1.5 MHz
I
SHDN
Shutdown Pin Current V
SHDN
= V
IN
0.01 0.1 µA
V
SHDN
= 0V −0.5 -1
I
L
Switch Leakage Current V
SW
= 18V 0.01 3 µA
R
DSON
Switch R
DSON
V
IN
= 2.7V, I
SW
= 1A 0.2 0.4 Ω
Th
SHDN
SHDN Threshold Output High 0.9 0.6 V
Output Low 0.6 0.3 V
UVP On Threshold 1.8 1.92 2.0 V
Off Threshold 1.7 1.82 1.9 V
θ
JA
Thermal Resistance Junction to Ambient
(6)
235 °C/W
Junction to Ambient
(7)
225
Junction to Ambient
(8)
220
Junction to Ambient
(9)
200
Junction to Ambient
(10)
195
(6) Junction to ambient thermal resistance (no external heat sink) for the VSSOP package with minimal trace widths (0.010 inches) from the
pins to the circuit. See "Scenario 'A'" in the Power Dissipation section.
(7) Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and
approximately 0.0191 sq. in. of copper heat sinking. See "Scenario 'B'" in the Power Dissipation section.
(8) Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and
approximately 0.0465 sq. in. of copper heat sinking. See "Scenario 'C'" in the Power Dissipation section.
(9) Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and
approximately 0.2523 sq. in. of copper heat sinking. See "Scenario 'D'" in the Power Dissipation section.
(10) Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and
approximately 0.0098 sq. in. of copper heat sinking on the top layer and 0.0760 sq. in. of copper heat sinking on the bottom layer, with
three 0.020 in. vias connecting the planes. See "Scenario 'E'" in the Power Dissipation section.
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