Datasheet

LM2621
SNVS033C –MAY 2004–REVISED MARCH 2005 www.ti.com
Connection Diagram
Figure 1. VSSOP-8 (DGK) Package - Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
SW Pin Voltage −0.5 V to 14.5V
BOOT, V
DD
, EN and FB Pins −0.5V to 10V
FREQ Pin 100µA
θ
JA
(3)
240°C/W
T
Jmax
(3)
150°C
Storage Temperature Range −65°C to +150°C
Lead Temp. (Soldering, 5 sec) 260°C
Power Dissipation (T
A
=25°C)
(3)
500mW
ESD Rating
(4)
2kV
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
jmax
(maximum junction temperature),
θ
JA
(junction to ambient thermal resistance), and T
A
(ambient temperature). The maximum allowable power dissipation at any
temperature is P
dmax
= (T
jmax
- T
A
)/ θ
JA
or the number given in the Absolute Maximum Ratings, whichever is lower.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. For Pin 8 (SW) the ESD rating is 1.5
kV.
OPERATING CONDITIONS
(1)
V
DD
Pin 2.5V to 5V
FB, EN Pins 0 to V
DD
BOOT Pin 0 to 10V
Ambient Temperature (T
A
) −40°C to +85°C
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated operating conditions.
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