Datasheet
LM2588
SNVS117D –APRIL 1998–REVISED APRIL 2013
www.ti.com
All Output Voltage Versions Electrical Characteristics
(1)
(continued)
Specifications with standard type face are for T
J
= 25°C, and those in bold type face apply over full Operating Temperature
Range. Unless otherwise specified, V
IN
= 5V.
Symbol Parameters Conditions Typical Min Max Units
I
EAO
Error Amp Output See
(4)
165 110/70 260/320 μA
Current (Source or
Sink)
I
SS
Soft Start Current V
FEEDBACK
= 0.92V
11.0 8.0/7.0 17.0/19.0 μA
V
COMP
= 1.0V
D
MAX
Maximum Duty Cycle R
LOAD
= 100Ω
(3)
98 93/90 %
I
L
Switch Leakage Switch Off
15 300/600 μA
Current V
SWITCH
= 60V
V
SUS
Switch Sustaining dV/dT = 1.5V/ns 65 V
Voltage
V
SAT
Switch Saturation I
SWITCH
= 5.0A 0.7 1.1/1.4 V
Voltage
I
CL
NPN Switch Current 6.5 5.0 9.5 A
Limit
V
STH
Synchronization F
SYNC
= 200 kHz
0.75 0.625/0.40 0.875/1.00 V
Threshold Voltage V
COMP
= 1V, V
IN
= 5V
I
SYNC
Synchronization V
IN
= 5V
100 200 μA
Pin Current V
COMP
= 1V, V
SYNC
= V
STH
V
SHTH
ON /OFF Pin (Pin 1) V
COMP
= 1V
(5)
1.6 1.0/0.8 2.2/2.4 V
Threshold Voltage
I
SH
ON /OFF Pin (Pin 1) V
COMP
= 1V
40 15/10 65/75 μA
Current V
SH
= V
SHTH
θ
JA
Thermal Resistance NDZ Package, Junction to Ambient
(6)
65
θ
JA
NDZ Package, Junction to Ambient
(7)
45
θ
JC
NDZ Package, Junction to Case 2
θ
JA
KTW Package, Junction to Ambient
(8)
56
°C/W
θ
JA
KTW Package, Junction to Ambient
(9)
35
θ
JA
KTW Package, Junction to 26
θ
JC
Ambient
(10)
2
KTW Package, Junction to Case
(4) To measure the worst-case error amplifier output current, the LM2588 is tested with the feedback voltage set to its low value (specified
in Note 3 under the All Output Voltage Versions Electrical Characteristics
()
table) and at its high value (specified in Note 2 under the All
Output Voltage Versions Electrical Characteristics
()
table).
(5) When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency
adjust circuit will begin operation (see Figure 54).
(6) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(7) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(8) Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the
same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(9) Junction to ambient thermal resistance01242001 for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square
inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(10) Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple
®
software.
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