Datasheet

LM2587
SNVS115D –APRIL 2000–REVISED APRIL 2013 www.ti.com
All Output Voltage Versions Electrical Characteristics
(1)
(continued)
Specifications with standard type face are for T
J
= 25°C, and those in bold type face apply over full Operating Temperature
Range. Unless otherwise specified, V
IN
= 5V.
Symbol Parameters Conditions Typical Min Max Units
I
SS
Soft Start Current V
FEEDBACK
= 0.92V 11.0 8.0/7.0 17.0/19.0 μA
V
COMP
= 1.0V
D Maximum Duty Cycle R
LOAD
= 100Ω 98 93/90 %
See
(3)
I
L
Switch Leakage Switch Off 15 300/600 μA
Current V
SWITCH
= 60V
V
SUS
Switch Sustaining dV/dT = 1.5V/ns 65 V
Voltage
V
SAT
Switch Saturation I
SWITCH
= 5.0A 0.7 1.1/1.4 V
Voltage
I
CL
NPN Switch 6.5 5.0 9.5 A
Current Limit
COMMON DEVICE PARAMETERS
(5)
θ
JA
Thermal Resistance NDH Package, Junction to Ambient
(6)
65
θ
JA
NDH Package, Junction to Ambient
(7)
45
θ
JC
NDH Package, Junction to Case 2
θ
JA
°C/W
KTT Package, Junction to Ambient
(8)
56
θ
JA
KTT Package, Junction to Ambient
(9)
35
θ
JA
KTT Package, Junction to Ambient
(10)
26
θ
JC
KTT Package, Junction to Case 2
(5) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2587 is used as shown in Figure 7 and Figure 8, system performance will be as specified by the system parameters.
(6) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(7) Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1oz.) copper area surrounding the leads.
(8) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the
same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(9) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(10) Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple
®
software.
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