Datasheet

LM1577, LM2577
SNOS658D –JUNE 1999–REVISED APRIL 2013 www.ti.com
Typical Performance Characteristics (continued)
Feedback Pin Bias
Current
vs Oscillator Frequency
Temperature vs Temperature
Figure 26. Figure 27.
Maximum Power Dissipation
(DDPAK/TO-263)
(1)
Figure 28.
(1) If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally
connected to the package. Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper area, θ
JA
is 37°C/W;
and with 1.6 or more square inches of copper area, θ
JA
is 32°C/W.
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