Datasheet

LM1575, LM2575-N, LM2575HV
www.ti.com SNVS106E –MAY 1999–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Circuit Figure 25 and Figure 26)
Maximum Power Dissipation
Feedback Pin Current (TO-263) (See
(1)
)
Figure 21. Figure 22.
Switching Waveforms Load Transient Response
V
OUT
= 5V
A: Output Pin Voltage, 10V/div
B: Output Pin Current, 1A/div
C: Inductor Current, 0.5A/div
D: Output Ripple Voltage, 20 mV/div,
AC-Coupled
Horizontal Time Base: 5 μs/div
Figure 23. Figure 24.
(1) If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally
connected to the package: Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with 1 square inch of copper area, θ
JA
is 37°C/W;
and with 1.6 or more square inches of copper area, θ
JA
is 32°C/W.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM1575 LM2575-N LM2575HV